Mount Board and Electronic Device

Abstract

An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1 , a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13 a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15 a disposed on the flat surface of the pedestal portion 13 a . The pedestal portion 13 a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15 a.

1 . A mount board with a semiconductor package mounted on a curved board thereof, said curved board including a curved surface on at least a portion thereof; wherein
 said curved board comprises:   a pedestal portion disposed on a region of said curved-surface portion where said semiconductor package is mounted and having an upper surface thereof formed flat, said upper surface being formed of an insulating material; and   a plurality of pad portions disposed on said flat surface of said pedestal portion;   said semiconductor package being mounted on said pad portions.   
     
     
         2 . The mount board according to  claim 1 , wherein said pedestal portion is formed by molding an insulating layer used on said curved board. 
     
     
         3 . The mount board according to  claim 1 , wherein said insulating layer includes shoulder portions on regions thereof adjacent to said pedestal portion, each of said shoulder portions having a flat surface; and
 said flat surface of said each of said shoulder portions is formed to be parallel to a tangent to said curved-surface portion.   
     
     
         4 . The mount board according to  claim 3 , comprising:
 a plurality of second pad portions disposed on said flat surface of said pedestal portion; and   electronic component(s) that is (are) mounted on said second pad portions.   
     
     
         5 . The mounding board according to  claim 1 , wherein said pedestal portion has a concave part in a region thereof between the pad portions adjacent to each other. 
     
     
         6 . The mount board according to  claim 1 , wherein said pedestal portion is formed by including a second insulating layer therein. 
     
     
         7 . The mount board according to  claim 6 , wherein said second insulating layer is formed of any one of a laminate, a thermoplastic resin, a hybrid-type resin, and an inorganic material, said laminate being formed by laminating film-like resins, said hybrid-type resin including a thermoplastic resin and a thermosetting resin. 
     
     
         8 . The mount board according to  claim 1 , wherein said pedestal portion is formed by molding an insulating material other than an insulating material of an insulating layer used on said curved board. 
     
     
         9 . The mount board according to  claim 8 , wherein said pedestal portion is formed of a filler-containing resin material. 
     
     
         10 . The mount board according to  claim 8 , wherein an electronic component(s) is (are) mounted inside said pedestal portion. 
     
     
         11 . A mount board with a semiconductor package mounted on a curved board thereof, said curved board including a curved surface on at least a portion thereof,
 said curved board comprising:   a pedestal portion disposed on a region of said curved-surface portion where said semiconductor package is mounted, said pedestal portion being formed of an insulating material;   said pedestal portion being formed by molding an insulating material other than an insulating material of an insulating layer used for said curved board;   said semiconductor package being disposed inside said pedestal portion;   external terminals of said semiconductor package being disposed on an opposite side of said surface of said board and being exposed from said pedestal portion;   said mount board comprising:   a wiring pattern disposed on at least said pedestal portion and said semiconductor package, said wiring pattern electrically connecting a wiring layer of said curved board and said external terminals of said semiconductor package.   
     
     
         12 . The mount board according to  claim 11 , comprising:
 an electronic component(s) mounted over said external terminals of said semiconductor package via pad portions of said wiring pattern.   
     
     
         13 . A curved board including a curved surface on at least a portion thereof, comprising:
 a pedestal portion disposed on a region of said curved-surface portion where a semiconductor package is mounted and having an upper surface thereof formed flat, said pedestal portion being formed of an insulating material; and   a plurality of pad portions disposed on said flat surface of said pedestal portion.   
     
     
         14 . The curved board according to  claim 13 , wherein said pedestal portion is formed by molding an insulating layer used on said curved board. 
     
     
         15 . The curved board according to  claim 13 , wherein
 said insulating layer includes shoulder portions on regions thereof adjacent to said pedestal portion, each of said shoulder portions having a flat surface; and   said flat surface of said each of said shoulder portions is formed to be parallel to a tangent to said curved-surface portion.   
     
     
         16 . The curved board according to  claim 15 , comprising:
 a plurality of second pad portions disposed on said flat surface of said pedestal portion; and   an electronic component(s) that is (are) mounted on said second pad portions.   
     
     
         17 . The curved board according to  claim 13 , wherein said pedestal portion has a concave part in a region thereof between the pad portions adjacent to each other. 
     
     
         18 . The curved board according to  claim 13 , wherein said pedestal portion is formed by including a second insulating layer therein. 
     
     
         19 . The curved board according to  claim 18 , wherein said second insulating layer is formed of one of a laminate, a thermoplastic resin, a hybrid-type resin, and an inorganic material, said laminate being formed by laminating film-like resins, said hybrid-type resin including a thermoplastic resin and a thermosetting resin. 
     
     
         20 . An electronic device comprising:
 the mount board according to  claim 1 .   
     
     
         21 . An electronic device comprising:
 the curved board including  claim 13 .