Methods and apparatus for cleaning deposition chamber parts using selective spray etch

Abstract

In one aspect, a method of cleaning an electronic device manufacturing process chamber part is provided, including a) spraying the part with an acid; b) spraying the part with DI water; and c) treating the part with potassium hydroxide. Other aspects are provided.

1 . A method of cleaning an electronic device manufacturing process chamber part comprising:
 spraying the part with an acid;   spraying the part with DI water; and   treating the part with potassium hydroxide.   
     
     
         2 . The method of  claim 1  wherein the acid comprises a mixture of acids. 
     
     
         3 . The method of  claim 1  where a metal film is cleaned from the part. 
     
     
         4 . The method of  claim 1  where a silicon compound is cleaned from the part. 
     
     
         5 . The method of  claim 1  wherein the step of spraying the part with an acid comprises using the part as a containment chamber. 
     
     
         6 . The method of  claim 1  wherein the step of spraying the part with an acid comprises measuring the temperature of the part and comparing the measured temperature to a desired temperature. 
     
     
         7 . The method of  claim 6  further comprising increasing the flow rate of acid to increase the temperature of the part. 
     
     
         8 . The method of  claim 6  further comprising decreasing the flow rate of acid to decrease the temperature of the part. 
     
     
         9 . The method of  claim 6  wherein the desired temperature is selected to provide a favorable part cleaning rate to part etching rate ratio. 
     
     
         10 . The method of  claim 1  wherein the step of spraying the part with an acid comprises placing the part on a turntable and rotating the turntable. 
     
     
         11 . The method of  claim 1  wherein the step of spraying the part with an acid comprises preferentially directing the spray toward a portion of the part which is coated with more of a material to be cleaned than another portion of the part is coated with. 
     
     
         12 . The method of  claim 1  wherein the part comprises an intentionally deposited coating and wherein the step of spraying the part with an acid comprises measuring the temperature of the part and comparing the measured temperature to a desired temperature; and wherein the desired temperature is selected to provide a favorable part cleaning rate to intended coating etching rate and a favorable part cleaning rate to part etching rate. 
     
     
         13 . The method of  claim 1  wherein the acid is heated prior to spraying the part with the acid. 
     
     
         14 . The method of  claim 1  wherein a portion of the part is masked prior to spraying the part with the acid. 
     
     
         15 . The method of  claim 1  wherein the step of spraying the part with DI water comprises spraying the water at a pressure of between about 500 and about 2000 p.s.i. 
     
     
         16 . The method of  claim 15  wherein the water is sprayed at a pressure of about 1000 p.s.i. 
     
     
         17 . A spray cleaning apparatus for components of an electronic device manufacturing process chamber comprising:
 a support member;   a spray nozzle attached to the support member;   a cleaning chemistry supply; and   a conduit adapted to convey cleaning chemistry from the cleaning chemistry supply to the spray nozzle;   wherein the spray nozzle attached to the support member is adapted to rotate and to move linearly and is adapted to direct a spray of cleaning chemistry to the interior of an electronic device manufacturing process chamber component from a plurality of directions.   
     
     
         18 . The spray cleaning apparatus of  claim 17  further comprising a temperature sensor adapted to measure the temperature of the chamber component. 
     
     
         19 . The spray cleaning apparatus of  claim 18  further comprising a controller which is adapted to compare a temperature of the chamber component to a predetermined temperature range and which is further adapted to change the flow rate of cleaning chemistry sprayed by the spray nozzle. 
     
     
         20 . The spray cleaning apparatus of  claim 19  wherein the controller is adapted to increase the flow of cleaning chemistry to increase the temperature of the chamber component. 
     
     
         21 . The spray cleaning apparatus of  claim 19  wherein the controller is adapted to decrease the flow of cleaning chemistry to decrease the temperature of the chamber component. 
     
     
         22 . A spray cleaning apparatus for components of an electronic device manufacturing process chamber comprising:
 a cleaning tank;   a plurality of spray nozzles connected to an arm;   a mounting device adapted to hold a process chamber component inside the tank; and   a cleaning chemistry supply connected to the spray nozzles;   wherein the arm is adapted to move the spray nozzles to direct a spray of cleaning chemistry at the chamber component from a plurality of directions.   
     
     
         23 . The spray cleaning apparatus of  claim 22  further comprising a controller which is adapted to direct the spray of cleaning chemistry from individual spray nozzles to increase the amount of cleaning chemistry which impacts portions of the chamber component which are more heavily coated with a film to be cleaned and to decrease the amount of cleaning chemistry which impacts portions of the chamber component which are less heavily coated with the film to be cleaned.