US2009000550A1PendingUtilityA1
Manifold assembly
Est. expiryJun 29, 2027(~0.9 yrs left)· nominal 20-yr term from priority
Y10T137/87571Y10T137/9029F16L 59/184
36
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Embodiments of a manifold assembly are provided herein. In some embodiments, a manifold assembly includes a first manifold having a first inlet, for coupling to a high temperature fluid source, and a first outlet; a second manifold having a second inlet and a second outlet; and a connector portion coupling the first outlet of the first manifold to the second inlet of the second manifold, the connector portion includes a polymer block; and a thermal isolator disposed between the polymer block and the first manifold.
Claims
exact text as granted — not AI-modified1 . A manifold assembly, comprising:
a first manifold having a first inlet, for coupling to a high temperature fluid source, and a first outlet; a second manifold having a second inlet and a second outlet; and a connector portion coupling the first outlet of the first manifold to the second inlet of the second manifold, the connector portion comprising:
a polymer block; and
a thermal isolator disposed between the polymer block and the first manifold.
2 . The manifold assembly of claim 1 , wherein the polymer block comprises polytetrafluoroethylene (PTFE).
3 . The manifold assembly of claim 1 , wherein the thermal isolator comprises ceramic.
4 . The manifold assembly of claim 1 , wherein the high temperature fluid source is a remote plasma source.
5 . The manifold assembly of claim 1 , wherein second manifold further comprises a plurality of cooling channels formed therein.
6 . The manifold assembly of claim 1 , wherein second manifold further comprises a second inlet for coupling to a second fluid source.
7 . The manifold assembly of claim 1 , wherein first manifold comprises aluminum.
8 . The manifold assembly of claim 1 , wherein second manifold comprises aluminum.
9 . The manifold assembly of claim 1 , further comprising:
a tube disposed within the polymer block.
10 . The manifold assembly of claim 9 , wherein the tube comprises aluminum.
11 . The manifold assembly of claim 9 , wherein the tube extends into the second manifold.
12 . A substrate processing apparatus, comprising:
a process chamber; a remote plasma source; and a manifold assembly coupling the remote plasma source to the chamber, the manifold assembly comprising:
a first manifold having a first inlet, for coupling to the remote plasma source, and a first outlet;
a second manifold having a second inlet and a second outlet; and
a connector portion coupling the first outlet of the first manifold to the second inlet of the second manifold, the connector portion comprising:
a polymer block; and
a thermal isolator disposed between the polymer block and the first manifold.
13 . The substrate processing apparatus of claim 12 , wherein the polymer block comprises polytetrafluoroethylene (PTFE).
14 . The substrate processing apparatus of claim 12 , wherein the thermal isolator comprises ceramic.
15 . The substrate processing apparatus of claim 12 , wherein second manifold further comprises a plurality of cooling channels formed therein.
16 . The substrate processing apparatus of claim 12 , wherein second manifold further comprises a second inlet for coupling to a second fluid source.
17 . The substrate processing apparatus of claim 12 , wherein first manifold comprises aluminum.
18 . The substrate processing apparatus of claim 12 , wherein second manifold comprises aluminum.
19 . The substrate processing apparatus of claim 12 further comprising a tube disposed within the polymer block.
20 . The substrate processing apparatus of claim 19 , wherein the tube comprises aluminum.
21 . The substrate processing apparatus of claim 19 , wherein the tube extends into the second manifold.Join the waitlist — get patent alerts
Track US2009000550A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.