Chamfering apparatus, a grinding wheel, and a chamfering method

Abstract

A chamfering apparatus for chamfering an outer periphery of a disk-shaped substrate includes a grinding member having a circular hole inside thereof, wherein the hole has a diameter larger than an outer diameter of the substrate. An inner periphery of the grinding member forming the hole is a grinding surface and grinds the outer periphery of the substrate.

1 . A chamfering apparatus for chamfering an outer periphery of a disk-shaped substrate, comprising:
 a grinding member having a circular hole inside thereof, the hole having a diameter larger than an outer diameter of the substrate to receive the substrate therein, and a grinding surface at an inner periphery thereof to chamfer the outer periphery of the substrate.   
   
   
       2 . A chamfering apparatus according to  claim 1 , wherein said grinding member includes, as the grinding surface, a recess provided along the inner periphery and having an upper machining plane and a lower machining plane with a vertical plane therebetween, the upper and lower machining planes being arranged obliquely with respect to the substrate to form upper and lower peripheral edges of the substrate, respectively. 
   
   
       3 . A chamfering apparatus according to  claim 1 , further comprising:
 a base member provided inside the hole for placing the substrate thereon and rotating the substrate, and   a pressing member provided inside the hole for sandwiching the substrate between the pressing member and the base member.   
   
   
       4 . A chamfering apparatus according to  claim 3 , further comprising grooves provided on the base member, and suction holes provided in the grooves and adapted to be connected to a suction pump for applying a negative pressure to the substrate to firmly attract the substrate to the base member. 
   
   
       5 . A chamfering apparatus according to  claim 4 , further comprising first means for rotating the base member in one direction, and second means for rotating the grinding member in a direction opposite to the one direction. 
   
   
       6 . A grinder for grinding a disk-shaped substrate to chamfer an outer periphery of the substrate, wherein the grinder has an annular shape with a hole therein, said hole having a diameter larger than an outer diameter of the substrate and being defined by an inner periphery, said inner periphery having a recess extending along the same to serve as a grinding surface contacting the substrate. 
   
   
       7 . A grinder according to  claim 6 , wherein said grinding surface comprises an upper machining plane and a lower machining plane with a vertical plane therebetween, provided in the recess, the upper and lower machining planes being arranged obliquely with respect to the substrate so that the upper and lower machining planes contact an upper and lower peripheral edges of the substrate for chamfering, respectively. 
   
   
       8 . A method of chamfering an outer periphery of a disk-shaped substrate, comprising:
 preparing a grinding member having a circular hole inside thereof, the hole having a diameter larger than an outer diameter of the substrate and being defined by an inner periphery,   arranging the substrate in the hole to contact the inner periphery of the grinding member to chamfer the substrate, and   rotating the grinding member and the substrate.   
   
   
       9 . A method of chamfering according to  claim 8 , wherein the grinding member has a groove with a grinding surface to chamfer the substrate. 
   
   
       10 . A method of chamfering according to  claim 8 , wherein said grinding member is rotated in one direction, and the substrate disposed on a base member is rotated in a direction opposite to the one direction.