US2008309371A1PendingUtilityA1
Face-to-face bonded i/o circuit die and functional logic circuit die system
Est. expirySep 29, 2024(expired)· nominal 20-yr term from priority
Inventors:Theodore Speers
H03K 19/17796H03K 19/17732H03K 19/17744H10W 90/754H10W 90/722H10W 72/9415H10W 72/923H10W 72/90H10W 72/9445H10W 90/00
46
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
An integrated circuit system includes a first set of integrated circuit dice each member of the set having a different configuration of input/output circuits disposed thereon and a second set of integrated circuit dice each having different logical function circuits disposed thereon. Each member of the first and second sets of integrated circuit dice include an array of face-to-face bonding pads disposed thereon that mate with the array of face-to-face bonding pads of each member of the other set.
Claims
exact text as granted — not AI-modified1 . An integrated circuit system including: a first integrated circuit die having input/output circuits disposed thereon; a second integrated circuit die having logical function circuits disposed thereon; and said first and second integrated circuit dice each include an array of mating face-to-face bonding structures disposed on opposing faces thereof and coupled respectively to said input/output circuits and said logical function circuits.
Join the waitlist — get patent alerts
Track US2008309371A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.