Micro-channel heat sink

Abstract

A micro-channel heat sink comprises an upper cover layer and a cooling layer. The cooling layer comprises at least one inlet fluid tank, a plurality of micro-channels, and at least one outlet fluid tank. The inlet fluid tank can store and deliver the working fluids, and the outlet fluid tank collects the heated working fluid flowing through the plurality of micro-channels. The plurality of micro-channels are disposed between the inlet fluid tank and the outlet fluid tank, wherein the cross sectional area of each of the micro-channels increases along the direction towards the outlet fluid tank.

1 . A micro-channel heat sink, comprising:
 a cooling layer, comprising:
 at least one inlet fluid tank storing and delivering a working fluid; 
 at least one outlet fluid tank collecting and draining the working fluid; and 
 a plurality of micro-channels disposed between the inlet fluid tank and the outlet fluid tank, wherein the cross sectional area of each of the micro-channels increases along a direction towards the outlet fluid tank; and 
   an upper cover layer covering the plurality of micro-channels.   
     
     
         2 . The micro-channel heat sink of  claim 1 , wherein the upper cover layer is an IC chip. 
     
     
         3 . The micro-channel heat sink of  claim 1 , wherein the cross sectional area of the micro-channel gradually increases along the direction towards the outlet fluid tank. 
     
     
         4 . The micro-channel heat sink of  claim 3 , wherein the width of the micro-channel gradually increases along the direction towards the outlet fluid tank. 
     
     
         5 . The micro-channel heat sink of  claim 3 , wherein the depth of the micro-channel gradually increases along the direction towards the outlet fluid tank. 
     
     
         6 . The micro-channel heat sink of  claim 1 , further comprising a plurality of channel walls separating the plurality of micro-channels, wherein the cross sectional area of the channel wall gradually decreases along the direction towards the outlet fluid tank. 
     
     
         7 . The micro-channel heat sink of  claim 1 , wherein the cooling layer comprises a silicon material. 
     
     
         8 . The micro-channel heat sink of  claim 1 , wherein the plurality of micro-channels are arranged in parallel. 
     
     
         9 . The micro-channel heat sink of  claim 1 , wherein the upper cover layer can be joined to an electrical component using a thermal adhesive. 
     
     
         10 . The micro-channel heat sink of  claim 1 , wherein the micro-channel can prevent backflow of bubbles in the boiling working fluid and instability of a two-phase flow resulting from the backflow.