Method and Device for Tempering a Substrate

Abstract

The invention concerns a device and a method for tempering a substrate (S), as well as a method for making such a device, which comprises the following elements: a first subelements ( 10 ) provided with a support surface ( 20 ) to be pressed against the substrate (S) and with a first connecting surface, a second subelement ( 12 ) provided with a second connecting surface ( 28 ) whereby it is pressed at least partly against the first connecting surface ( 10 ). At least one of the two subelements ( 10, 12 ) contains a ceramic material. At least one of the two connecting surfaces ( 22, 28 ) comprises at least one recess ( 24, 30 ) which defines at least one cavity ( 32 ) in the device. At least one first connecting opening enables a thermostatic liquid to be circulated and/or supplied towards and/or from the cavity ( 32 ).

1 . A device for regulating the temperature of a substrate (S) comprising:
 a first partial element ( 10 ) which has a bearing area ( 20 ) for bearing against the substrate (S) and also a first connecting area ( 22 ), and   a second partial element ( 12 ), which has a second connecting area ( 28 ), via which it bears at least partly against the first connecting area ( 22 ) of the first partial element ( 10 ),   wherein at least one of the two partial elements ( 10 ,  12 ) comprises ceramic material,   at least one cutout ( 24 ,  30 ) which defines at least one cavity ( 32 ) in the device is provided at least in one of the two connecting areas ( 22 ,  28 ), and   at least one first connection opening ( 48 ) is provided via which a temperature-regulating fluid inflow and/or outflow to and/or from the at least one cavity ( 32 ) is made possible.   
   
   
       2 . The device as claimed in  claim 1 , wherein in addition at least one second connection opening ( 52 ) is provided via which a fluid outflow and/or inflow from and/or to the at least one cavity ( 32 ) is made possible. 
   
   
       3 . The device as claimed in  claim 2 , wherein the cavity ( 32 ) forms at least one continuous channel between the first ( 48 ) and the second connection opening ( 52 ). 
   
   
       4 . The device as claimed in  claim 3 , wherein the at least one continuous channel runs essentially in meandering fashion. 
   
   
       5 . The device as claimed in  claim 3 , wherein the continuous channel is arranged in such a way that a fluid throughflow from the first connection opening through the channel to the second connection opening takes place essentially on the basis of the countercurrent principle. 
   
   
       6 . The device as claimed in  claim 3 , wherein ribs ( 34 ) are formed in the channel, the longitudinal direction of said ribs running in the direction of the channel. 
   
   
       7 . The device as claimed in  claim 1 , wherein in each case at least one cutout ( 24 ,  30 ) is provided in both partial elements ( 10 ,  12 ), which cutouts together form the at least one cavity ( 32 ). 
   
   
       8 . The device as claimed in  claim 7 , wherein the connecting areas ( 22 ,  28 ) lie essentially in a connecting plane and the cutouts ( 24 ,  30 ) are formed in the two partial elements symmetrically with respect to the connecting plane. 
   
   
       9 . The device as claimed in  claim 1 , wherein an electrically conductive connecting layer ( 26 ) is arranged at at least one of the two connecting areas ( 22 ,  28 ), said connecting layer preferably comprising nickel or copper. 
   
   
       10 . The device as claimed in  claim 1 , wherein an electrically conductive first shielding layer ( 18 ) is arranged at least partly at the bearing area ( 20 ). 
   
   
       11 . The device as claimed in  claim 1 , wherein the second partial element ( 12 ) additionally has an outer area ( 36 ) at which an electrically conductive second shielding layer ( 38 ) is arranged at least in regions. 
   
   
       12 . The device as claimed in  claim 1 , wherein the second partial element ( 12 ) has an outer area ( 36 ) onto which an integrated heating element ( 40 ) is arranged and/or an external heating element can be fitted. 
   
   
       13 . A method for producing a device for regulating the temperature of a substrate (S) comprising the following steps in this order:
 (a) providing a first partial element ( 10 ) having a bearing area ( 20 ) and a first connecting area ( 22 ) and a second partial element ( 12 ) having a second connecting area ( 28 ), wherein at least one of the two partial elements ( 10 ,  12 ) comprises ceramic material;   (b) forming at least one cutout ( 24 ,  30 ) in at least one of the two connecting areas ( 22 ,  28 );   (c) connecting the first connecting area ( 22 ) of the first partial element ( 10 ) to the second connecting area ( 28 ) of the second partial element ( 12 ) in such a way that the at least one cutout ( 24 ,  30 ) forms a cavity ( 32 ) in the device,   wherein   at least one connection opening ( 48 ) is formed via which a temperature- regulating fluid inflow and/or outflow to and/or from the at least one cavity ( 32 ) is made possible.   
   
   
       14 . The method as claimed in  claim 13 , wherein step (c) of connecting the two partial elements ( 10 , 12 ) comprises brazing. 
   
   
       15 . The method as claimed in  claim 13 , wherein step (a) of providing the first ( 10 ) and second partial element ( 12 ) comprises a step of forming the first ( 10 ) and/or second partial element ( 12 ) as a first and/or a second green blank composed of ceramic material. 
   
   
       16 . The method as claimed in  claim 15 , which additionally comprises a step of firing the first and/or second partial element formed as green blank, wherein step (b) of forming the at least one cutout ( 24 ,  30 ) is effected before the step of firing the corresponding partial element in which the cutout ( 24 ,  30 ) is formed. 
   
   
       17 . The method as claimed in one of  claims 13  to  16 , which additionally comprises a step of forming at least a first electrically conductive shielding layer ( 18 ) at the bearing area ( 20 ) and/or a second electrically conductive shielding layer ( 38 ) at an outer area ( 36 ) of the second partial element ( 12 ). 
   
   
       18 . A method for regulating the temperature of a substrate (S), comprising the following steps:
 providing a device for regulating the temperature of a substrate the device having a first partial element ( 10 ) which has a bearing area ( 20 ) for bearing against the substrate (S) and also a first connecting area ( 22 ), and a second partial element ( 12 ), which has a second connecting area ( 28 ), via which it bears at least partly against the first connecting area ( 22 ) of the first partial element ( 10 ), wherein at least one of the two partial elements ( 10 ,  12 ) comprises ceramic material, at least one cutout ( 24 ,  30 ) which defines at least one cavity ( 32 ) in the device is provided at least in one of the two connecting areas ( 22 ,  28 ), and at least one first connection opening ( 48 ) is provided via which a temperature-regulating fluid inflow and/or outflow to and/or from the at least one cavity ( 32 ) is made possible, the device having;   arranging the substrate (S) at least partly against the bearing area ( 20 );   supplying and/or discharging a fluid to and/or from the at least one cavity ( 32 ) via the at least one first connection opening ( 48 ).   
   
   
       19 . The method as claimed in  claim 18 , wherein the fluid is supplied to the at least one cavity ( 32 ) via the at least one first connection opening ( 48 ) and is discharged from the at least one cavity ( 32 ) via the at least one second connection opening ( 52 ). 
   
   
       20 . The method as claimed in  claim 19 , wherein the temperature and/or the flow rate of the supplied fluid is varied for the open-loop or closed-loop control of the temperature of the substrate (S). 
   
   
       21 . The method as claimed in  claim 18 , wherein vacuum grooves are formed in the bearing area ( 20 ) and the method additionally comprises a step of sucking up the substrate (S) by means of the vacuum grooves. 
   
   
       22 . The method as claimed in  claim 18 , further comprising:
 arranging an electrically conductive first shielding layer ( 18 ) at least Partly at the bearing area ( 20 );   arranging an electrically conductive second shielding layer ( 38 ) at least in regions of an outer area ( 36 ) of the second partial element;   arranging an integrated heating element ( 40 ) onto an outer area ( 36 ) of the second partial element ( 12 );   applying force potential to the first shielding layer ( 18 ),   applying shield potential to the second shielding layer ( 38 ), and   applying guard potential to the connecting layer ( 26 ).   
   
   
       23 . The method as claimed in  claim 18 , wherein a heating element ( 40 ) is arranged at an outer area ( 36 ) of the second partial element ( 12 ) and an open-loop or closed-loop control of the temperature of the substrate (S) comprises an open-loop or closed-loop control of the temperature and/or the heating power of the heating element ( 40 ).