Novel Packaging Solution for Highly Filled Phase-Change Thermal Interface Material

Abstract

A packaging system, packaging method and method of depositing a thin layer of material at a desired location upon a substrate, and in particular a layer of thermally-conductive phase change material at the interface between a heat-dissipating component and heat sink coupled therewith. The packaging comprises a thin layer of material sandwiched between a first base liner and a second top liner. A segment of tape is adhesively bound to the top liner and preferably includes a graspable portion, such as a tab, to enable the same to pull the top liner away from the material to thus leave the layer of material deposited upon the substrate.

1 . A packaging system for a layer of material comprising:
 a) a base liner, said layer of material being formed upon said base liner;   b) a top liner disposed substantially over said layer of material deposited upon said base liner; and   c) a tape segment adhesively bound to at least a portion of said top liner.   
     
     
         2 . The system of  claim 1  wherein said layer of material comprises a thermally-conductive composition. 
     
     
         3 . The system of  claim 2  wherein said thermally-conductive composition possesses phase-change properties. 
     
     
         4 . The system of  claim 1  wherein said segment of tape has a tab formed thereon. 
     
     
         5 . The system of  claim 1  wherein said base liner and said top liner comprise paper release liners. 
     
     
         6 . The system of  claim 1  wherein said layer of material and said top liner define a length and a width and said tape extends across a respective one of said length and width defined by said layer of material and top liner. 
     
     
         7 . The system of  claim 6  wherein said layer of tape further extends to and is adhesively bound to said base liner. 
     
     
         8 . The system of  claim 7  wherein said tape is adhesively bound to said base liner at a point beyond the peripheral edge defined by said layer of material and said top liner. 
     
     
         9 . The system of  claim 1  wherein said layer of material comprises a thermally-conductive composition having a thickness of approximately 8 mil. 
     
     
         10 . A method for packaging a layer of material comprising the steps:
 a) providing a base liner;   b) depositing said layer of material upon said base liner provided in step a);   c) placing a top liner over said layer of material deposited upon said base liner; and   d) rolling said base liner and top liner with layer of material disposed therebetween such that said layer of material assumes a desired thickness; and   e) adhesively attaching a segment of tape to said top liner positioned over said layer of material in step c).   
     
     
         11 . The method of  claim 10  wherein in step b), said layer of material comprises a thermally-conductive composition; and wherein in step d), said layer is formed to have a thickness of approximately 8 mil. 
     
     
         12 . The method of  claim 11  wherein in step b), said thermally-conductive material is a phase-change material. 
     
     
         13 . The method of  claim 10  wherein in step d), said tape segment is adhesively attached to both said top liner and said base liner. 
     
     
         14 . The method of  claim 10  wherein in step d), said layer is formed to have a specific surface area. 
     
     
         15 . The method of  claim 14  wherein said layer of material is formed to have a generally square shape. 
     
     
         16 . The method of  claim 15  wherein said generally square shape is approximately one inch by one inch. 
     
     
         17 . The method of  claim 10  wherein following step e) said method further comprises the step:
 a) forming a tab upon said segment of tape.   
     
     
         18 . The method of  claim 17  wherein said tab is formed by folding a portion of said tape segment upon itself. 
     
     
         19 . A method of applying a pre-packaged layer of material upon a desired portion of a substrate comprising the steps:
 a) providing a pre-packaged layer of material, said pre-packaged layer of material comprising:
 i) a base liner and a top liner, said layer of material being disposed between said base liner and top liner; and 
 ii) a tape segment adhesively bound to at least a portion of said top liner; 
   b) removing said base liner from said packaging such that a portion of said layer of material is exposed;   c) placing said exposed layer of material in step b) upon the desired portion of said substrate; and   d) pulling said tape with said top liner adhesively bound thereto away from said layer of material positioned upon said substrate in step c).   
     
     
         20 . The method of  claim 19  wherein in step a), said layer of material comprises a thermally-conductive material and wherein in step c), said substrate comprises a heat sink. 
     
     
         21 . The method of  claim 20  wherein said thermally-conductive material comprises a phase change material. 
     
     
         22 . The method of  claim 19  wherein in step a), said base liner and said top liner comprise paper release liners. 
     
     
         23 . The method of  claim 19  wherein step c) further comprises adhesively attaching a portion of said tape segment to said substrate. 
     
     
         24 . The method of  claim 10  wherein said method further comprises the step:
 a) forming said packaged layer of material in step d) as a roll.