CMP apparatus

Abstract

The present invention provides a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance. The present invention is a CMP apparatus, at least one covered surface selected from the group consisting of a head portion surface and an arm portion surface for holding a polishing target member on a polishing pad, a slurry feed pipe surface and an apparatus main body inside wall being covered with a fluororesin.

1 - 10 . (canceled) 
     
     
         11 . A CMP apparatus comprising a main body including an inside wall, said main body housing a surface plate and a polishing pad disposed on said surface plate, a polishing head including a first surface facing the polishing pad and an arm connected to a second surface of the polishing head, and a slurry feed pipe for dispensing a polishing slurry, wherein an inside surface of said CMP apparatus is covered with a single-layer fluororesin film. 
     
     
         12 . The CMP apparatus as claimed in  claim 11 , wherein a surface of said arm is covered with a single-layer fluororesin film via an adhesive layer. 
     
     
         13 . The CMP apparatus as claimed in  claim 11 , wherein a surface of said inside wall is covered with a single-layer fluororesin film via an adhesive layer. 
     
     
         14 . The CMP apparatus as claimed in  claim 11 , adapted for polishing a polishing target member positioned between the polishing pad and the first surface of the polishing head, and wherein said polishing head and surface plate are movable relative to one another. 
     
     
         15 . The CMP apparatus as claimed in  claim 11 , wherein said arm is connected to a second surface of the polishing head opposite the first surface and is rotatable. 
     
     
         16 . A CMP apparatus comprising a main body including an inside wall, said main body housing a surface plate and a polishing pad disposed on said surface plate, a polishing head including a first surface facing the polishing pad and an arm connected to a second surface of the polishing head, and a slurry feed pipe for dispensing a polishing slurry, wherein an inside surface of said CMP apparatus is covered with a laminate of a fluororesin layer and a thermoplastic resin layer made of a thermoplastic resin other than said fluororesin. 
     
     
         17 . The CMP apparatus as claimed in  claim 16 , wherein the internal surface is covered with said laminate via an adhesive layer and said thermoplastic resin layer of the laminate is closer to the covered surface than the fluororesin layer. 
     
     
         18 . The CMP apparatus as claimed in  claim 16 , wherein said fluororesin layer comprises a fluororesin containing at least one bonding group selected from the group consisting of a carbonyl group, a carbonyl group-containing group, an epoxy group, a hydroxyl group, an amino group, a silyl group, a group containing a carbon-carbon double bond, a sulfonic acid group, a group containing an ether bond and a cyano group. 
     
     
         19 . The CMP apparatus as claimed in  claim 17 , wherein said adhesive layer comprises an acrylic adhesive. 
     
     
         20 . The CMP apparatus as claimed in  claim 16 , wherein a surface of said arm is covered with said laminate via an adhesive layer. 
     
     
         21 . The CMP apparatus as claimed in  claim 16  wherein a surface of said inside wall is covered with said laminate via an adhesive layer. 
     
     
         22 . The CMP apparatus as claimed in  claim 16 , wherein the thermoplastic resin layer of said laminate comprises a polyamide resin. 
     
     
         23 . The CMP apparatus as claimed in  claim 16 , wherein the thermoplastic resin layer of said laminate comprises an ethylene/vinyl alcohol resin. 
     
     
         24 . The CMP apparatus as claimed in  claim 16 , wherein the thermoplastic resin layer of said laminate comprises an epoxy-modified polyethylene resin. 
     
     
         25 . The CMP apparatus as claimed in  claim 16 , wherein the fluororesin layer of said laminate has a thickness of 1 to 20 μm. 
     
     
         26 . A CMP apparatus comprising a main body including an inside wall, said main body housing a surface plate and a polishing pad disposed on said surface plate, a polishing head including a first surface facing the polishing pad and an arm connected to a second surface of the polishing head, and a slurry feed pipe for dispensing a polishing slurry, wherein an inside surface of said CMP apparatus is covered with a fluororesin film by applying a fluororesin-based powder coating composition to the inside surface. 
     
     
         27 . The CMP apparatus as claimed in  claim 26 , wherein the fluororesin of said fluororesin-based powder coating composition contains at least one bonding group selected from the group consisting of a carbonyl group, a carbonyl group-containing group, an epoxy group, a hydroxyl group, an amino group, a silyl group, a group containing a carbon-carbon double bond, a sulfonic acid group, a group containing an ether bond and a cyano group. 
     
     
         28 . The CMP apparatus as claimed in claim  1 , wherein the single-layer fluororesin film is removable from the inside surface of the CMP apparatus. 
     
     
         29 . The CMP apparatus as claimed in  claim 16 , wherein the laminate is removable from the inside surface of the CMP apparatus. 
     
     
         30 . The CMP apparatus as claimed in  claim 26 , wherein the fluororesin film is removable from the inside surface of the CMP apparatus.