US2008299748A1PendingUtilityA1

Group III-V Crystal

Assignee: SUMITOMO ELECTRIC INDUSTRIESPriority: May 8, 2003Filed: Aug 8, 2008Published: Dec 4, 2008
Est. expiryMay 8, 2023(expired)· nominal 20-yr term from priority
H10P 14/3414H10P 14/2921H10P 14/2905H10P 14/272H10P 14/2904C30B 25/18Y10T428/12674C30B 29/40H01S 5/323Y10T428/12681C30B 25/02C30B 29/406C30B 29/403
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Claims

Abstract

Favorable-quality III-V crystals are easily obtained at low cost without causing cracks, even when using a variety of substrates. The III-V crystals are obtained by manufacturing method characterized in including: a step of depositing a metal film ( 2 ) on a substrate ( 1 ); a step of heat-treating the metal film ( 2 ) in an atmosphere in which a patterning compound is present; and a step of growing a group III-V crystal ( 4 ) on the metal film after the heat treatment. Alternatively, the III-V crystal manufacturing method is characterized in including: a step of growing a group III-V compound buffer film on the metal film after the heat treatment; and a step of growing a group III-V crystal on the group III-V compound buffer film.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a crystal of a group III-V compound, the method comprising:
 a physical vapor deposition step of depositing a metal film on a substrate by either evaporation or sputtering;   a heat-treatment step of heat-treating the metal film under an atmosphere in which a metal-film patterning compound is present so that the metal film becomes patterned with a plurality of grooves having an indefinite shape, the grooves having an average width of 2 nm to 5000 nm, the metal film having an aperture fraction of 5% to 80%, the aperture fraction being the percentage of the surface area that the grooves occupy with respect to the substrate total surface area; and   a growth step of growing a group III-V crystal on the post-heat-treated metal film.

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