Production method of multilayer electronic device

Abstract

A production method of a multilayer electronic device, comprising the steps of forming a lower side green sheet 10 a including at least a ceramic powder on a supporting body 20 ; forming an electrode pattern layer 12 a on a surface of the lower side green sheet; forming a green chip by stacking multilayer units U 1 including at least the lower side green sheet and an electrode pattern layer; and firing the green chip; wherein the lower side green sheet 10 a formed on the supporting body 20 includes a binder of a curable resin, and the curable resin in the lower side green sheet 10 a is cured before forming said electrode pattern layer 12 a on the lower side green sheet.

1 - 5 . (canceled) 
   
   
       6 . A production method of a multilayer electronic device, comprising the steps of:
 forming a lower side green sheet including at least a ceramic powder on a supporting body;   forming an electrode pattern layer on a surface of said lower side green sheet;   forming a green chip by stacking multilayer units including at least said lower side green sheet and an electrode pattern layer; and   firing said green chip;   wherein the lower side green sheet formed on said supporting body includes a binder of a curable resin, and the curable resin in said lower side green sheet is cured before forming said electrode pattern layer on the lower side green sheet.   
   
   
       7 . The production method of a multilayer electronic device as set forth in  claim 6 , further comprising the steps of:
 forming an intermediate green sheet including a binder of a curable resin on an electrode pattern layer after forming said electrode pattern layer on said lower side green sheet;   curing the curable resin in said intermediate green sheet after that; and   forming an electrode pattern layer on said intermediate green sheet after that;   wherein:   two or more said electrode pattern layers are formed via one or more said intermediate green sheet on said supporting sheet;   an upper side green sheet is formed on an electrode pattern layer positioned on top;   said multilayer unit is composed of said lower side green sheet, one or more said intermediate green sheet, two or more said electrode pattern layers and said upper side green sheet; and   said upper side green sheet includes a binder of a curable resin, which is not cured to give adhesiveness to the sheet.   
   
   
       8 . The production method of a multilayer electronic device as set forth in  claim 7 , wherein a binder of a curable resin included in said upper side green sheet is the same kind as that included in said lower side green sheet and said intermediate green sheet. 
   
   
       9 . The production method of a multilayer electronic device as set forth in  claim 6 , wherein said curable resin is any one of a thermosetting resin, an ultraviolet ray curable resin and an electron beam curable resin. 
   
   
       10 . The production method of a multilayer electronic device as set forth in  claim 6 , further comprising the steps of:
 forming an intermediate green sheet including a binder of a curable resin on an electrode pattern layer after forming said electrode pattern layer on said lower side green sheet;   curing the curable resin in said intermediate green sheet after that; and   forming an electrode pattern layer on said intermediate green sheet after that;   wherein:   two or more said electrode pattern layers are formed via one or more said intermediate green sheet on said supporting sheet;   an upper side green sheet is formed on an electrode pattern layer positioned on top;   said multilayer unit is composed of said lower side green sheet, one or more said intermediate green sheet, two or more said electrode pattern layers and said upper side sheet; and   said upper side green sheet includes a binder consisting essentially of a thermoplastic resin.   
   
   
       11 . The production method of a multilayer electronic device as set forth in  claim 10 , wherein a thickness of said intermediate green sheet is approximately equal to a sum of a thickness of said lower side green sheet and a thickness of said upper side green sheet. 
   
   
       12 . The production method of a multilayer electronic device as set forth in  claim 10 , further comprising the step of forming a blank pattern layer on blank portions not formed with said electrode pattern layer on said green sheet before forming said intermediate green sheet or said upper side green sheet on said electrode pattern layer. 
   
   
       13 . A production method of a multilayer electronic device, comprising the steps of:
 forming a lower side green sheet including at least a ceramic powder and a binder of a curable resin on a supporting body;   curing said curable resin included in said lower side green sheet;   forming an electrode pattern layer on a surface of said lower side green sheet;   forming an intermediate green sheet including at least a ceramic powder and a binder of a curable resin on said electrode pattern layer;   curing the curable resin in said intermediate green sheet; and   forming an electrode pattern layer on said intermediate green sheet;   wherein:   two or more said electrode pattern layers are formed on said supporting body via one or more said intermediate green sheet;   an upper side green sheet including at least a ceramic powder and a binder consisting essentially of a thermoplastic resin is formed on an electrode pattern layer positioned on top;   a multilayer unit composed of single said lower side green sheet, one or more but not more than 50 layers of said intermediate green sheet, two or more but not more than 51 layers of said electrode pattern layers and single said upper side green sheet is formed on said supporting body; and   two or more said multilayer units released from said supporting body are stacked, so that said lower side green sheet contacts said upper side green sheet, to form a green chip and, then, said green chip is fired.   
   
   
       14 . A production method of a multilayer electronic device, comprising the steps of:
 forming a lower side green sheet including at least a ceramic powder and a binder of a curable resin on a supporting body;   curing said curable resin included in said lower side green sheet;   forming an electrode pattern layer on a surface of said lower side green sheet;   forming an intermediate green sheet including at least a ceramic powder and a binder of a curable resin on said electrode pattern layer;   curing the curable resin in said intermediate green sheet; and   forming an electrode pattern layer on said intermediate green sheet;   wherein:   two or more said electrode pattern layers are formed on said supporting body via one or more said intermediate green sheet;   an upper side green sheet including at least a ceramic powder and a binder of a curable resin is formed on an electrode pattern layer positioned on top;   a multilayer unit composed of single said lower side green sheet, one or more but not more than 50 layers of said intermediate green sheet, two or more but not more than 51 layers of said electrode pattern layers and single said upper side green sheet is formed on said supporting body; and   without curing the curable resin in said upper side green sheet, two or more said multilayer units released from said supporting body are stacked, so that said lower side green sheet contacts said upper side green sheet, to form a green chip and, then, said green chip is fired.