Methods and apparatus for polishing a notch of a substrate using a polishing pad

Abstract

Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavity adapted to be filled with a pressure-controlled medium; and a tip region having a shape that corresponds to a shape of the notch, wherein the polishing pad is adapted to contact the polishing tape and press the polishing tape against the notch. Numerous other aspects are provided.

1 . An apparatus for polishing a notch of a substrate using a polishing tape comprising:
 a polishing head adapted to apply the polishing tape against the notch of the substrate, including:   a polishing pad having:
 a cavity adapted to be filled with a pressure-controlled medium; and 
 a tip region having a shape that corresponds to a shape of the notch, 
   wherein the polishing pad is adapted to contact the polishing tape and press the polishing tape against the notch.   
   
   
       2 . The apparatus of  claim 1  wherein the pressure-controlled medium is a pressurizable gas. 
   
   
       3 . The apparatus of  claim 1  wherein the polishing pad is wheel-shaped. 
   
   
       4 . The apparatus of  claim 3  wherein the polishing pad is adapted to rotate with a circumferential speed substantially equal to a polishing tape advancement speed. 
   
   
       5 . The apparatus of  claim 1  wherein the polishing pad is substantially planar-shaped. 
   
   
       6 . The apparatus of  claim 1  wherein the polishing pad includes an outer skin layer. 
   
   
       7 . An apparatus for polishing a notch of a substrate using a polishing tape comprising:
 a polishing head adapted to apply the polishing tape against the notch of the substrate, comprising:
 a polishing pad having a tip region having a shape that corresponds to a shape of the notch, the polishing pad adapted to contact the polishing tape and press the polishing tape against the notch; and 
 one or more guides adapted to prevent the polishing tape from moving out from between the polishing pad and the notch. 
   
   
   
       8 . The apparatus of  claim 7  wherein the polishing pad is wheel-shaped. 
   
   
       9 . The apparatus of  claim 8  wherein the polishing pad is adapted to rotate. 
   
   
       10 . The apparatus of  claim 9  wherein the polishing pad is adapted to rotate with a circumferential speed substantially equal to a polishing tape advancement speed. 
   
   
       11 . The apparatus of  claim 7  wherein the polishing pad is substantially planar-shaped. 
   
   
       12 . The apparatus of  claim 7  wherein the polishing pad includes an outer skin layer. 
   
   
       13 . The apparatus of  claim 12  wherein the outer skin layer is adapted to cover a ridge region. 
   
   
       14 . The apparatus of  claim 12  wherein the polishing tape is adapted to travel over the ridge region during application of the polishing tape to the notch. 
   
   
       15 . The apparatus of  claim 7  wherein the one or more guides are coupled to one or more support blocks. 
   
   
       16 . The apparatus of  claim 7  wherein the one or more guides are integrally formed in one or more support blocks. 
   
   
       17 . An apparatus for polishing a notch of a substrate using a polishing tape comprising:
 a polishing head adapted to apply the polishing tape against the notch of the substrate, including:
 a polishing pad including one or more slots for guiding the polishing tape; and 
 a notch polishing pad embedded in the polishing pad and adapted to contact the polishing tape and press the polishing tape against the notch. 
   
   
   
       18 . The apparatus of  claim 17  wherein the polishing pad is wheel-shaped. 
   
   
       19 . The apparatus of  claim 18  wherein the polishing pad is adapted to rotate. 
   
   
       20 . The apparatus of  claim 17  wherein the polishing pad is substantially planar-shaped. 
   
   
       21 . The apparatus of  claim 17  wherein the notch polishing pad includes a protruding portion having a shape that corresponds to a shape of the notch. 
   
   
       22 . The apparatus of  claim 21  wherein the protruding portion includes a bore. 
   
   
       23 . The apparatus of  claim 21  wherein the notch polishing pad includes at least one plateau region. 
   
   
       24 . The apparatus of  claim 23  wherein the at least one plateau region is adapted to conform the polishing tape to at least one corner of the notch. 
   
   
       25 . The apparatus  claim 21  wherein the protruding portion has a height and the notch has a depth and wherein the height of the protruding portion is greater than the depth of the notch. 
   
   
       26 . The apparatus of  claim 17  wherein the polishing pad has a hardness of less than about 70 Shore A durometers.