Methods and apparatus for using a rolling backing pad for substrate polishing

Abstract

An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.

1 . An apparatus for polishing an edge of a substrate comprising:
 a polishing head including a backing pad, wherein a width of the backing pad that contacts a substrate edge is larger than a width of a notch in the substrate edge.   
   
   
       2 . The apparatus of  claim 1  wherein the backing pad is cylindrically shaped. 
   
   
       3 . The apparatus of  claim 2  wherein the backing pad includes a bore therethrough. 
   
   
       4 . The apparatus of  claim 3  further comprising a roller. 
   
   
       5 . The apparatus of  claim 4  wherein the backing pad is mounted on the roller via the bore. 
   
   
       6 . The apparatus of  claim 5  wherein the backing pad is adapted to rotate about the roller. 
   
   
       7 . The apparatus of  claim 1 , wherein the backing pad is adapted to conform to the substrate edge. 
   
   
       8 . The apparatus of  claim 1  wherein the polishing head is adapted to rock about the substrate edge. 
   
   
       9 . The apparatus of  claim 1  wherein the backing pad is adapted to press a polishing tape against the substrate edge. 
   
   
       10 . A system for polishing an edge of a substrate comprising:
 a substrate support adapted to rotate a substrate;   a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge; and   a controller adapted to operate the rotation of the substrate and the polishing head.   
   
   
       11 . The system of  claim 10  wherein the backing pad is cylindrically shaped. 
   
   
       12 . The system of  claim 11  wherein the backing pad includes a bore therethrough. 
   
   
       13 . The system of  claim 12  further comprising a roller. 
   
   
       14 . The system of  claim 13  wherein the backing pad is mounted on the roller via the bore. 
   
   
       15 . The system of  claim 10 , wherein the backing pad is adapted to conform to the substrate edge. 
   
   
       16 . The system of  claim 10  wherein the polishing head is adapted to rock about the substrate edge. 
   
   
       17 . The system of  claim 10  wherein the backing pad is adapted to press a polishing tape against the substrate edge. 
   
   
       18 . A method for polishing an edge of a substrate comprising:
 rotating a substrate; and   contacting an edge of the substrate with a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge the backing pad.   
   
   
       19 . The method of  claim 18  further comprising:
 pressing a polishing tape against the substrate edge with the backing pad.   
   
   
       20 . The method of  claim 19  further comprising:
 advancing the polishing tape in increments.   
   
   
       21 . The method of  claim 19  further comprising:
 advancing the polishing tape continuously.   
   
   
       22 . The method of  claim 18  wherein the polishing pad is coupled to a polishing head. 
   
   
       23 . The method of  claim 22  further comprising:
 rocking the polishing head about the edge of the substrate.   
   
   
       24 . The method of  claim 18  further comprising:
 rotating the backing pad about a roller.   
   
   
       25 . The method of  claim 18  further comprising:
 determining that a pre-set amount of film has been removed from the substrate edge.