Methods and apparatus to control substrate bevel and edge polishing profiles of films

Abstract

Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled portion adapted to provide a pre-set film profile. Numerous other aspects are provided.

1 . An apparatus for polishing a film on an edge of a substrate comprising:
 a polishing head having:   a backing plate adapted to press polishing material against a film on an edge of a substrate, wherein the backing plate has a profile portion adapted to provide a pre-set film profile during polishing of the substrate.   
   
   
       2 . The apparatus of  claim 1  wherein the profile portion is smooth. 
   
   
       3 . The apparatus of  claim 2  wherein the profile portion is adapted to provide a gradual curvature to the film profile. 
   
   
       4 . The apparatus of  claim 1  wherein the profile portion is formed by a flat region and a curved region. 
   
   
       5 . The apparatus of  claim 4  wherein the flat region and the curved region are conjoined at a cut-off joint. 
   
   
       6 . The apparatus of  claim 5  wherein the cut-off joint is adapted to provide a sharp and angled film profile. 
   
   
       7 . The apparatus of  claim 1  wherein the backing plate is adapted to rock about the substrate edge. 
   
   
       8 . A system for polishing a film on an edge of a substrate comprising:
 a substrate support, adapted to support and rotate a substrate;   a polishing head having:   a backing plate adapted to press polishing material against a film on an edge of a substrate, wherein the backing plate has a profile portion adapted to provide a pre-set film profile during polishing of the substrate; and   a controller adapted to operate the movement of the polishing head.   
   
   
       9 . The system of  claim 8  wherein the profile portion is smooth. 
   
   
       10 . The system of  claim 9  wherein the profile portion is adapted to provide a gradual curvature to the film profile. 
   
   
       11 . The system of  claim 8  wherein the profile portion is formed by a flat region and a curved region. 
   
   
       12 . The system of  claim 11  wherein the flat region and the curved region are conjoined at a cut-off joint. 
   
   
       13 . The system of  claim 12  wherein the cut-off joint is adapted to provide a sharp and angled film profile. 
   
   
       14 . The system of  claim 8  wherein the backing plate is adapted to rock about the substrate edge. 
   
   
       15 . The system of  claim 14  wherein the controller is adapted to control the rocking of the backing plate. 
   
   
       16 . The system of  claim 15  wherein the backing plate is adapted to rock in a path between a rocking start angle and a rocking end angle. 
   
   
       17 . The system of  claim 8  further comprising a backing pad adapted to conform to the shape of the backing plate. 
   
   
       18 . A method for polishing a film on an edge of a substrate comprising:
 selecting a rocking start angle and a rocking end angle for a profiled backing plate;   contacting a film on an edge of a substrate with the backing plate and a polishing material; and   rocking the backing plate against the film on the substrate edge during polishing.   
   
   
       19 . An apparatus for polishing a film on an edge of a substrate comprising:
 a backing plate adapted to press polishing material against a film on an edge of a substrate, wherein the backing plate has a profile portion adapted to provide a pre-set film profile during polishing of the substrate.