US2008293335A1PendingUtilityA1

Methods and apparatus for substrate edge polishing using a polishing arm

Assignee: APPLIED MATERIALS INCPriority: May 21, 2007Filed: May 21, 2008Published: Nov 27, 2008
Est. expiryMay 21, 2027(~0.8 yrs left)· nominal 20-yr term from priority
B24B 21/004B24B 9/065B24B 27/0038
47
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing tape, ii) a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm and iii) a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction perpendicular to the longitudinal axis of the polishing arm. Numerous other aspects are provided.

Claims

exact text as granted — not AI-modified
1 . An apparatus adapted to polish an edge of a substrate comprising:
 a polishing tape having a polishing surface and a second surface; and   a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate, the polishing arm including:
 a polishing head adapted to contact the second surface of the polishing tape; 
 a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm; and 
 a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction substantially perpendicular to the longitudinal axis of the polishing arm. 
   
   
   
       2 . The apparatus of  claim 1  wherein the polishing head is adapted to oscillate as it forces the polishing surface of the polishing tape into contact with the edge of the substrate. 
   
   
       3 . The apparatus of  claim 2 , wherein the oscillation may be at least one of continuous and intermittent. 
   
   
       4 . The apparatus of  claim 1  further comprising a polishing pad coupled to the polishing head and adapted to contact the second surface of the polishing tape. 
   
   
       5 . The apparatus of  claim 4  further comprising a backing block adapted to couple the polishing pad to the polishing head. 
   
   
       6 . The apparatus of  claim 1  further comprising a rocker motor coupled to the rocker arm. 
   
   
       7 . The apparatus of  claim 6  wherein the rocker motor is adapted to rotate the rocker arm. 
   
   
       8 . The apparatus of  claim 1  further comprising an actuator coupled to the load arm. 
   
   
       9 . The apparatus of  claim 8 , wherein the actuator is adapted to extend and retract the load arm, such that the polishing surface of the polishing tape is forced into contact with the edge of the substrate. 
   
   
       10 . The apparatus of  claim 9  further comprising a pivot mechanism adapted to couple the actuator to the load arm. 
   
   
       11 . A system adapted to polish an edge of a substrate comprising:
 a housing; and   one or more edge polishing apparatus, wherein the edge polishing apparatus comprises:
 a polishing tape having a polishing surface and a second surface; and 
 a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate, the polishing arm including:
 a polishing head adapted to contact the second surface of the polishing tape; 
 a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm; and 
 a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction substantially perpendicular to the longitudinal axis of the polishing arm. 
 
   
   
   
       12 . The system of  claim 11  further comprising a central platform positioned centrally to the one or more edge polishing apparatus. 
   
   
       13 . The system of  claim 12  wherein the central platform is adapted to support the substrate. 
   
   
       14 . The system of  claim 11  further comprising a controller. 
   
   
       15 . The system of  claim 14  wherein the controller is adapted to direct the operation of the system. 
   
   
       16 . The system of  claim 11  wherein the polishing head is adapted to oscillate as it forces the polishing surface of the polishing tape into contact with the edge of the substrate. 
   
   
       17 . The system of  claim 11  further comprising a rocker motor coupled to the rocker arm and adapted to rotate the rocker arm. 
   
   
       18 . The system of  claim 11  further comprising an actuator coupled to the load arm. 
   
   
       19 . The system of  claim 18  wherein the actuator is adapted to extend and retract the load arm, such that the polishing surface of the polishing tape is forced into contact with the edge of the substrate. 
   
   
       20 . A method for polishing an edge of a substrate comprising:
 retracting an actuator in a direction substantially perpendicular to the longitudinal axis of a polishing arm, and away from a substrate;   moving a pivot mechanism in a counter-clockwise direction in response to the retraction of the actuator;   extending a load arm forward towards the substrate in response to the movement of the pivot mechanism; and   contacting an edge of the substrate with a polishing tape in response to the forward movement of the load arm.   
   
   
       21 . The method of  claim 20  further comprising contacting the polishing tape with a backing pad in response to the forward movement of the load arm such that the polishing tape contacts the edge of the substrate. 
   
   
       22 . The method of  claim 21  wherein the backing pad is coupled to a head portion of the polishing arm. 
   
   
       23 . The method of  claim 22  further comprising oscillating the polishing head as it forces the polishing tape into contact with the edge of the substrate. 
   
   
       24 . The method of  claim 20  wherein an actuator is coupled to the load arm and adapted to extend the load arm. 
   
   
       25 . The method of  claim 20  wherein an actuator is coupled to the load arm and adapted to retract the load arm.

Join the waitlist — get patent alerts

Track US2008293335A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.