Methods and apparatus for substrate edge polishing using a polishing arm
Abstract
Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing tape, ii) a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm and iii) a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction perpendicular to the longitudinal axis of the polishing arm. Numerous other aspects are provided.
Claims
exact text as granted — not AI-modified1 . An apparatus adapted to polish an edge of a substrate comprising:
a polishing tape having a polishing surface and a second surface; and a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate, the polishing arm including:
a polishing head adapted to contact the second surface of the polishing tape;
a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm; and
a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction substantially perpendicular to the longitudinal axis of the polishing arm.
2 . The apparatus of claim 1 wherein the polishing head is adapted to oscillate as it forces the polishing surface of the polishing tape into contact with the edge of the substrate.
3 . The apparatus of claim 2 , wherein the oscillation may be at least one of continuous and intermittent.
4 . The apparatus of claim 1 further comprising a polishing pad coupled to the polishing head and adapted to contact the second surface of the polishing tape.
5 . The apparatus of claim 4 further comprising a backing block adapted to couple the polishing pad to the polishing head.
6 . The apparatus of claim 1 further comprising a rocker motor coupled to the rocker arm.
7 . The apparatus of claim 6 wherein the rocker motor is adapted to rotate the rocker arm.
8 . The apparatus of claim 1 further comprising an actuator coupled to the load arm.
9 . The apparatus of claim 8 , wherein the actuator is adapted to extend and retract the load arm, such that the polishing surface of the polishing tape is forced into contact with the edge of the substrate.
10 . The apparatus of claim 9 further comprising a pivot mechanism adapted to couple the actuator to the load arm.
11 . A system adapted to polish an edge of a substrate comprising:
a housing; and one or more edge polishing apparatus, wherein the edge polishing apparatus comprises:
a polishing tape having a polishing surface and a second surface; and
a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate, the polishing arm including:
a polishing head adapted to contact the second surface of the polishing tape;
a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm; and
a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction substantially perpendicular to the longitudinal axis of the polishing arm.
12 . The system of claim 11 further comprising a central platform positioned centrally to the one or more edge polishing apparatus.
13 . The system of claim 12 wherein the central platform is adapted to support the substrate.
14 . The system of claim 11 further comprising a controller.
15 . The system of claim 14 wherein the controller is adapted to direct the operation of the system.
16 . The system of claim 11 wherein the polishing head is adapted to oscillate as it forces the polishing surface of the polishing tape into contact with the edge of the substrate.
17 . The system of claim 11 further comprising a rocker motor coupled to the rocker arm and adapted to rotate the rocker arm.
18 . The system of claim 11 further comprising an actuator coupled to the load arm.
19 . The system of claim 18 wherein the actuator is adapted to extend and retract the load arm, such that the polishing surface of the polishing tape is forced into contact with the edge of the substrate.
20 . A method for polishing an edge of a substrate comprising:
retracting an actuator in a direction substantially perpendicular to the longitudinal axis of a polishing arm, and away from a substrate; moving a pivot mechanism in a counter-clockwise direction in response to the retraction of the actuator; extending a load arm forward towards the substrate in response to the movement of the pivot mechanism; and contacting an edge of the substrate with a polishing tape in response to the forward movement of the load arm.
21 . The method of claim 20 further comprising contacting the polishing tape with a backing pad in response to the forward movement of the load arm such that the polishing tape contacts the edge of the substrate.
22 . The method of claim 21 wherein the backing pad is coupled to a head portion of the polishing arm.
23 . The method of claim 22 further comprising oscillating the polishing head as it forces the polishing tape into contact with the edge of the substrate.
24 . The method of claim 20 wherein an actuator is coupled to the load arm and adapted to extend the load arm.
25 . The method of claim 20 wherein an actuator is coupled to the load arm and adapted to retract the load arm.Join the waitlist — get patent alerts
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