Polishing pad, use thereof and method for making the same

Abstract

The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.

1 . A polishing pad comprising:
 a buffer sheet comprising fibers;   a polishing sheet comprising a first elastomer, said polishing sheet comprising a polishing surface for polishing a substrate; and   adhesive for adhering the buffer sheet to the polishing sheet, the adhesive comprising a second elastomer,   wherein the second elastomer comprises at least one selected from the group consisting of polyvinyl chloride, polystyrene, polyethylene, polyamide, polyether, polypropylene, ethylene/vinyl acetate, a copolymer thereof, a block copolymer thereof, a mixture thereof, and a blend thereof.   
     
     
         2 . The polishing pad according to  claim 1 , wherein the buffer sheet comprises a non-woven fabric. 
     
     
         3 . The polishing pad according to  claim 1 , wherein the fibers are selected from the group consisting of a single fiber and composite fibers. 
     
     
         4 . The polishing pad according to  claim 1 , wherein the fibers are made of at least one material selected from the group consisting of polyamide, tereplithalamide, polyester, polymethyl methacrylate, polyethylene terephthalate, polyacrylonitrile, and a mixture thereof. 
     
     
         5 . The polishing pad according to  claim 1 , wherein the first elastomer comprises a foam resin. 
     
     
         6 . The polishing pad according to  claim 1 , wherein the first elastomer comprises at least one selected from the group consisting of polyurethane, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastic rubber, polystyrene, polyaromatic molecules, fluorine-containing polymer, polyidmide, cross-linked polyurethane, cross-linked polyolefin, polyether, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethylene, poly(ethylene terephthalate), polyaromatic amide, polyarylalkene, polymethyl methacrylate, a copolymer thereof, a block copolymer thereof, a mixture thereof, and a blend thereof. 
     
     
         7 . The polishing pad according to  claim 6 , wherein the first elastomer comprises polyurethane. 
     
     
         8 . The polishing pad according to  claim 1 , wherein the polishing sheet comprises fibers. 
     
     
         9 . The polishing pad according to  claim 8 , wherein the fibers in the polishing sheet comprise a non-woven fabric. 
     
     
         10 . The polishing pad according to  claim 8 , wherein the fibers in the polishing sheet are selected from the group consisting of a single fiber and composite fibers. 
     
     
         11 . The polishing pad according to  claim 8 , wherein the fibers in the polishing sheet are made of at least one material selected from the group consisting of polyamide, terephthalamide, polyester, polymethyl methacrylate, polyethylene terephthalate, and polyacrylonitrile, and a mixture thereof. 
     
     
         12 . The polishing pad according to  claim 8 , wherein the polishing sheet comprises a plurality of continuous pores embedded in the fibers and the first elastomer. 
     
     
         13 . (canceled) 
     
     
         14 . The polishing pad according to  claim 12 , wherein the second elastomer comprises polyurethane. 
     
     
         15 . The polishing pad according to  claim 1 , wherein the adhesive is selected from the group consisting of single-part adhesive, two-part adhesive and wet solidification adhesive. 
     
     
         16 . The polishing pad according to  claim 15 , wherein the two-part adhesive comprises the second elastomer and polyisocyanate. 
     
     
         17 . A method of polishing a substrate comprising using the polishing pad according to  claim 1  to polish a surface of the substrate. 
     
     
         18 . A method for manufacturing the polishing pad according to  claim 1 , comprising the steps of:
 (a) providing the buffer sheet and the polishing sheet;   (b) applying the second elastomer on a surface of the buffer sheet or the polishing sheet; and   (c) adhering the buffer sheet to the polishing sheet.   
     
     
         19 . The method according to  claim 18 , wherein step (b) comprises coating, spraying, printing or scraping the second elastomer on a surface of the buffer sheet or the polishing sheet. 
     
     
         20 . The method as claimed in  claim 18 , which after step (c) further comprises a curing step.