Thermosetting encapsulation adhesive sheet

Abstract

A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device ( 1 ) having connection electrodes (bumps) ( 3 ) and mounted on a wiring circuit board ( 2 ). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×10 4 to 5×10 6 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

1 . A thermosetting encapsulation adhesive sheet for encapsulating a chip type device mounted on a substrate, the thermosetting encapsulation adhesive sheet comprising an epoxy resin composition having a viscosity of 5×10 4  to 5×10 6  Pa·s as measured at a temperature of 80° C. to 120° C. before thermosetting thereof. 
   
   
       2 . A thermosetting encapsulation adhesive sheet as set forth in  claim 1 , wherein the epoxy resin composition comprises the following components (A) to (E):
 (A) an epoxy resin;   (B) a phenol resin;   (C) an elastomer;   (D) an inorganic filler; and   (E) a curing accelerating agent.   
   
   
       3 . A thermosetting encapsulation adhesive sheet as set forth in  claim 2 , wherein the inorganic filler (D) is present in the epoxy resin composition in a proportion of 60 to 80% by weight based on the weight of the epoxy resin composition. 
   
   
       4 . A thermosetting encapsulation adhesive sheet as set forth in  claim 2 , wherein the curing accelerating agent (E) is a quaternary phosphonium salt compound. 
   
   
       5 . A thermosetting encapsulation adhesive sheet as set forth in  claim 3 , wherein the curing accelerating agent (E) is a quaternary phosphonium salt compound.