System-in-package type semiconductor device

Abstract

A system-in-package type semiconductor device includes a plurality of semiconductor chips, a first semiconductor chip 1110 to which electric power is supplied from first power supply wiring 1111 , and first ground wiring 1112 to which the first circuit unit is coupled. Moreover, the system-in-package type semiconductor device includes a second semiconductor chip 1120 to which electric power is supplied from second power supply wiring 1124 , and second ground wiring 1125 coupled to the second circuit unit. The first semiconductor chip includes a first interface circuit unit 1412 , and the second circuit unit includes a second interface circuit unit 1121 configured to perform inputting or outputting of a signal to and from the first interface circuit unit. The first ground wiring 1414 is coupled to the second ground wiring 1424 through a protection circuit 1442 , and the second interface circuit unit is placed in the vicinity of the first interface circuit unit.

1 - 17 . (canceled) 
     
     
         18 . A system-in-package type semiconductor device having a first chip and a second chip to be mounted on one package, wherein
 the first chip includes a first internal circuit unit and a first interface circuit unit,   the second chip includes a second internal circuit unit and a second interface circuit unit,   the first internal circuit unit and second internal circuit unit are different in power supply system,   the first internal circuit unit and the second internal circuit unit perform input and/or output of signals through the first interface circuit unit and the second interface circuit unit, and   power supply systems of the first interface circuit unit and the second interface circuit unit are commonized.   
     
     
         19 . The system-in-package type semiconductor device according to  claim 18 , wherein power supply systems of the first internal circuit and the first interface circuit unit are commonized. 
     
     
         20 . The system-in-package type semiconductor device according to  claim 19 , wherein power is supplied to the first internal circuit through an external terminal formed on the first chip, and power is supplied to the second internal circuit through an external terminal formed on the second chip. 
     
     
         21 . The system-in-package type semiconductor device according to  claim 18 , wherein the first chip further includes a power supply wiring for supplying power to the first interface circuit unit, and power is supplied to the second internal circuit unit through the power supply wiring and power supply systems of the first interface circuit unit and the second internal circuit unit are commonized. 
     
     
         22 . The system-in-package type semiconductor device according to  claim 21 , wherein the second interface circuit unit and the second internal circuit unit are different in power supply system. 
     
     
         23 . The system-in-package type semiconductor device according to  claim 22 , wherein the second chip includes a first power supply wiring for supplying power to the second interface circuit unit and a second power supply wiring for supplying power to the second internal circuit unit, and the first power supply wiring and the second power supply wiring are connected through a protection circuit. 
     
     
         24 - 30 . (canceled)