Cooling device

Abstract

The present invention relates to a cooling structure for motor of fan, which includes a housing, an impeller and a circuit board. The housing has an air flow channel and a base; the base is located on one side of the air flow channel to support the circuit board, and the impeller is movably integrated on the base; the circuit board is bonded with a highly heat-conductive metal on at least one side thereof so as to provide good heat dissipation and heat transfer performance; at least one portion of the circuit board is extended beyond the hub of the impeller such that the extended portion is located at a downwind place of the blades of the impeller to facilitate fast heat dissipation.

1 . A cooling structure for motor of fan, comprising:
 a housing having an air inlet, an air flow channel, an air outlet and a base, wherein said air inlet and said air outlet are located on both sides of said air flow channel, and said base is disposed on one side of said air flow channel;   an impeller rotationally integrated on said base and having a hub and a plurality of blades; and   a circuit board disposed on said base, wherein at least one side thereof is installed with a highly heat-conductive metal, and at least one portion thereof is extended beyond said hub of said impeller, so that said extended portion is located at a downwind place to facilitate heat dissipation.   
   
   
       2 . The cooling structure of  claim 1 , wherein said circuit board is selected from one of flexible printed circuit board and regular printed circuit board. 
   
   
       3 . The cooling structure of  claim 1 , wherein said highly heat-conductive metal is chosen from one of aluminum and zinc. 
   
   
       4 . The cooling structure of  claim 1 , wherein said circuit board has a protrusion extended beyond said hub of said impeller and located at a downwind place of said blades. 
   
   
       5 . The cooling structure of  claim 4 , wherein a plurality of ribs are provided between said base and an inner wall of said air flow channel, at least a rib is equipped with a cable slot, and said protrusion is located above said rib with said cable slot. 
   
   
       6 . The cooling structure of  claim 1 , wherein said circuit board has a form selected from one of circle, rectangle and sector. 
   
   
       7 . The cooling structure of  claim 6 , wherein said circular circuit board has a diameter expandable to be greater than that of said hub. 
   
   
       8 . The cooling structure of  claim 6 , wherein said rectangular and sector circuit boards have at least one side or at least one corner extended beyond said hub.