US2008283159A1PendingUtilityA1
Soft copper alloy, and soft copper wire or plate material
Est. expiryJun 23, 2025(expired)· nominal 20-yr term from priority
C22C 9/00
58
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Claims
Abstract
A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, includes casting a molten alloy of a copper alloy including 10 mass ppm or less of oxygen, and 0.005 mass % to 0.6 mass % of indium, at a predetermined temperature, to provide a cast bar of the copper alloy having equiaxed crystal, rolling the cast bar of the copper alloy having equiaxed crystal to provide a rolled copper alloy, and conducting a cold drawing and annealing on the rolled copper alloy.
Claims
exact text as granted — not AI-modified1 . A method of fabricating soft copper alloy wire having flexure resistance and heat resistance, comprising:
casting a molten alloy of a copper alloy comprising 10 mass ppm or less of oxygen, and 0.005 mass % to 0.6 mass % of indium, at a predetermined temperature, to provide a cast bar of the copper alloy having equiaxed crystal; rolling the cast bar of the copper alloy having equiaxed crystal to provide a rolled copper alloy; and conducting a cold drawing and annealing on the rolled copper alloy.
2 . The method for fabricating soft copper alloy wire having flexure resistance and heat resistance, according to claim 1 , wherein a temperature of molten alloy in casting is 10° C. to 50° C. greater than a melting temperature of the copper alloy.
3 . The method for fabricating soft copper alloy wire having flexure resistance and heat resistance, according to claim 1 , wherein the copper alloy further comprises 0.0001 mass % to 0.003 mass % of phosphorus.
4 . The method for fabricating soft copper alloy wire having flexure resistance and heat resistance, according to claim 1 , wherein the copper alloy further comprises 0.01 mass % to 0.1 mass % of boron.
5 . The method for fabricating soft copper alloy wire having flexure resistance and heat resistance, according to claim 1 , wherein the copper alloy includes phosphorus and boron together in a range of 0.1 mass % or less.
6 . The method for fabricating soft copper alloy wire having flexure resistance and heat resistance, according to claim 1 , wherein the indium included in the copper alloy is 0.1 mass % to 0.2 mass %.
7 . The method of fabricating soft copper alloy wire having flexure resistance and heat resistance, according to claim 1 , wherein the annealing is conducted after the cold drawing, wherein an average crystal gain size after annealing is in a range from 2 μm to 20 μm.Join the waitlist — get patent alerts
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