Print board and manufacturing method thereof

Abstract

A method for manufacturing such a printed board with high efficiency is disclosed. The printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.

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         20 . A method for manufacturing a printed board including a board-shaped insulator made of an electrical insulating material, a wiring pattern layer provided on at least one surface of the insulator or wiring pattern layers provided on at least one surface of the insulator and inside the insulator, a conduction hole for electrically coupling the wiring pattern layers provided so as to be insulated from each other by interposition of the insulator, and at least one layer of board-shaped carbon-containing member principally made of carbon and provided in a laminated form separately from the wiring pattern layer by interposing the insulator, the method comprising:
 a covered carbon-containing material forming step of forming a covered carbon-containing member whose both surfaces are covered with an electrical insulating material included in the insulator by crimping the electrical insulating material included in the insulator on both surfaces of the board-shaped carbon-containing member;   a covered carbon-containing member hole making step of making a hole having a circumference larger than a circumference of the conduction hole at a position corresponding to the conduction hole of a covered carbon-containing member obtained in the covered carbon-containing member forming step; and   a printed board-use laminated board forming step of forming a printed board-use laminated board by interposing an electrical insulating material included in the insulator between the covered carbon-containing member in which a hole having a circumference larger than a circumference of the conduction hole is made in the covered carbon-containing member hole making step, and the wiring pattern layer or a conductor layer for forming a wiring pattern, and then crimping the electrical insulating material, the covered carbon-containing material, and the wiring pattern layer or conductor layer.   
     
     
         21 . The printed board manufacturing method according to  claim 20 ,
 wherein the covered carbon containing member forming step includes:   a laminating step of laminating the electrical insulating material included in the insulator on both surfaces of the board-shaped carbon containing member and laminating, outside the electrical insulating material, a metal sheet made of metal that can be eliminated by etching;   a crimping step of crimping the carbon containing member, the electrical insulating material, and the metal sheet laminated in the laminating step to obtain a laminated body; and   a metal sheet eliminating step of eliminating the metal sheet by etching from a laminated board obtained by crimping in the crimping step to obtain the covered carbon containing member.   
     
     
         22 . The printed board manufacturing method according to  claim 20 , further comprising:
 an outer layer wiring pattern forming step of forming a wiring pattern serving as a wiring pattern layer from the conductor layer provided on a surface of the insulator in a laminated board for printed board formed in the laminated board for printed board forming step; and   a solder resist film forming step of forming a solder resist film on a wiring pattern formed in the outer layer wiring pattern forming step to obtain the printed board.   
     
     
         23 . The printed board manufacturing method according to  claim 22 ,
 wherein the printed board has a conduction hole for electrically coupling the wiring pattern layers provided so as to be insulated from each other by interposition of the insulator, and   
       the printed board further includes:
 a conduction hole making step of making the conduction hole on a laminated board for printed board formed in the laminated board for printed board forming step; and 
 a conduction hole plating step of plating a conduction hole drilled in the conduction hole making step in order to electrically couple the wiring pattern layers insulated from each other by interposition of the insulator. 
 
     
     
         24 . The printed board manufacturing method according to  claim 22 ,
 wherein the printed board has a heat radiating cavity for coupling between the wiring pattern layer provided on a surface of the insulator and on which one or a plurality of electronic components are to be packaged and the carbon containing member, and   the printed board further includes:   a heat radiating cavity making step of making the heat radiating cavity in a laminated board for printed board formed in the laminated board for printed board forming step; and   a heat radiating material filling step of filling a heat radiating hole drilled in the heat radiating cavity making step with a heat radiating material.   
     
     
         25 . The printed board manufacturing method according to  claim 20 ,
 wherein the board-shaped carbon containing member is a member obtained by filling a gap in a network knitted from a heat conductive material with a material principally made of carbon.