Polishing composition

Abstract

The present invention provides a polishing composition containing an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or more amino groups, two or more imino groups, or one or more amino groups and one or more imino groups; a method for manufacturing a substrate with the polishing composition; and a method for reducing surface stains of a substrate with the polishing composition. The polishing composition can be suitably used, for example, in the manufacturing step for a substrate for a hard disk such as a memory hard disk.

1 . A method for manufacturing a polished substrate for a hard disk, comprising the step of:
 feeding a polishing composition comprising an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or more amino groups, two or more imino groups, or one or more amino groups and one or more imino groups to a substrate for a hard disk, and polishing the substrate with a polishing pad.   
   
   
       2 . The method according to  claim 1 , wherein the abrasive is an alumina. 
   
   
       3 . The method according to  claim 1 , wherein the organic nitrogen-containing compound has a molecular weight of from 150 to 100000. 
   
   
       4 . The method according to  claim 1 , wherein the organic nitrogen-containing compound is contained in an amount of from 0.001 to 0.5% by weight of the polishing composition. 
   
   
       5 . The method according to  claim 1 , wherein the organic nitrogen-containing compound and the organic polybasic acid are contained in a weight ratio of the organic nitrogen-containing compound/the organic polybasic acid of from 1/10000 to 1/1. 
   
   
       6 . The method according to  claim 1 , further comprising an oxidizing agent. 
   
   
       7 . The method according to  claim 1 , wherein the polishing composition has a pH of from 1 to 7. 
   
   
       8 . The method according to  claim 1 , wherein a flow rate of the polishing composition is from 0.01 to 0.5 mL/minute per 1 cm 2  of the substrate. 
   
   
       9 . The method according to  claim 1 , wherein a polishing pressure is from 2 to 30 kPa. 
   
   
       10 . A method for manufacturing a polished substrate, comprising the steps of:
 feeding a polishing composition comprising an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, an oxidizing agent consisting essentially of hydrogen peroxide and water, wherein the organic nitrogen-containing compound is one or more members selected from the group consisting of polyalkyleneimines having a molecular weight of from 300 to 2000, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, bis(3-aminopropyl)amine, and 1,3-propanediamine, and wherein the polishing composition has a pH of from 1 to 4 to a substrate to be polished at a flow rate of from 0.01 to 0.5 mL/minute per 1 cm 2  of the substrate, and   polishing the substrate with a polishing pad.   
   
   
       11 . The method according to  claim 10 , wherein a polishing pressure is from 2 to 30 kPa. 
   
   
       12 . A method for reducing surface stains on a substrate for a hard disk, comprising the steps of:
 feeding a polishing composition comprising an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or more amino groups, two or more imino groups, or one or more amino groups and one or more imino groups to a substrate for a hard disk, and polishing the substrate with a polishing pad.   
   
   
       13 . The method according to  claim 12 , wherein the abrasive is an alumina. 
   
   
       14 . The method according to  claim 12 , wherein the organic nitrogen-containing compound has a molecular weight of from 150 to 100000. 
   
   
       15 . The method according to  claim 12 , wherein the organic nitrogen-containing compound is contained in an amount of from 0.001 to 0.5% by weight of the polishing composition. 
   
   
       16 . The method according to  claim 12 , wherein the organic nitrogen-containing compound and the organic polybasic acid are contained in a weight ratio of the organic nitrogen-containing compound/the organic polybasic acid of from 1/10000 to 1/1. 
   
   
       17 . The method according to  claim 12 , further comprising an oxidizing agent. 
   
   
       18 . The method according to  claim 12 , wherein the polishing composition has a pH of from 1 to 7. 
   
   
       19 . The method according to  claim 12 , wherein a flow rate of the polishing composition is from 0.01 to 0.5 mL/minute per 1 cm 2  of the substrate. 
   
   
       20 . The method according to  claim 12 , wherein a polishing pressure is from 2 to 30 kPa. 
   
   
       21 . A method for reducing surface stains on a substrate, comprising the steps of:
 feeding a polishing composition comprising an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, an oxidizing agent consisting essentially of hydrogen peroxide and water, wherein the organic nitrogen-containing compound is one or more members selected from the group consisting of polyalkyleneimines having a molecular weight of from 300 to 2000, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, bis(3-aminopropyl)amine, and 1,3-propanediamine, and wherein the polishing composition has a pH of from 1 to 4 to a substrate to be polished at a flow rate of from 0.01 to 0.5 mL/minute per 1 cm 2  of the substrate, and   polishing the substrate with a polishing pad.