Operative method of a manufacturing system

Abstract

An operative method of a manufacturing system for processing a substrate is provided. The manufacturing system includes at least a handling system, two deposition apparatus groups, an etching apparatus group, a photolithography apparatus group and two photoresist-striping apparatus groups. The handling system has a plurality of handling paths comprising at least two connected ring paths, which are connected in a common path. These deposition apparatus groups and the photoresist-striping apparatus groups are located on the two ring paths respectively. The etching apparatus group is located on the common path. The photolithography apparatus group is located on the two ring paths between the two deposition apparatus groups. The manufacturing system of the present invention thus combines the advantages of the group-type manufacturing system and the continuous-type manufacturing system.

1 . An operative method of a manufacturing system for processing a substrate, comprising:
 providing a manufacturing system, comprising:
 a handling system, having a plurality of handling paths, the handling paths comprising at least a first ring path and a second ring path, wherein the first ring path and the second ring path is connected in a common path, and the substrate is moved by the handling system on the handling paths; 
 a first deposition apparatus group located on one side of the first ring path; 
 an etching apparatus group located on at least one side of the common path; 
 a second deposition apparatus group located on one side of the second ring path; 
 a photolithography apparatus group located on one side of the first ring path and the second ring path between the first deposition apparatus group and the second deposition apparatus group; 
 a first photoresist-striping apparatus group located on another side of the second ring path; and 
 a second photoresist-striping apparatus group located another side of on the first ring path; 
   (a) moving the substrate to the first deposition apparatus group by the handling system for a first deposition process;   (b) moving the substrate from the first deposition apparatus group to the photolithography apparatus group for a first photolithography process;   (c) moving the substrate from the photolithography apparatus group to the etching apparatus group for a first etching process to form a first patterned film on the substrate;   (d) moving the substrate from the etching apparatus group to the first photoresist-striping apparatus group for a first photoresist-striping process.   (e) moving the substrate from the first photoresist-striping apparatus group to the second deposition apparatus group for a second deposition process;   (f) moving the substrate from the second deposition apparatus group to the photolithography apparatus group for a second photolithography process;   (g) moving the substrate from the photolithography apparatus group to the etching apparatus group for a second etching process to form a second patterned film on the substrate; and   (h) moving the substrate from the etching apparatus group to the second photoresist-striping apparatus group for a second photoresist-striping process.   
   
   
       2 . The operative method of the manufacturing system of  claim 1 , further comprising moving the substrate from the second photoresist-striping apparatus group to the first deposition apparatus group, and repeating the steps (a) to (c) to form a third patterned film, and repeating the steps (e) to (g) to form a fourth patterned film. 
   
   
       3 . The operative method of the manufacturing system of  claim 1 , wherein after the substrate is moved from the first photoresist-striping apparatus group or the second photoresist-striping apparatus group, an intermediate testing process is performed on the substrate. 
   
   
       4 . The operative method of the manufacturing systems of  claim 1 , wherein after all the manufacturing processes are complete, a final testing process is performed on the substrate. 
   
   
       5 . The operative method of the manufacturing system of  claim 1 , wherein before the substrate is moved to the first deposition apparatus group, a cleaning process is performed on the substrate. 
   
   
       6 . The operative method of the manufacturing system of  claim 1 , wherein before the substrate is moved to the second deposition apparatus group, a cleaning step is performed on the substrate. 
   
   
       7 . The operative method of the manufacturing system of  claim 1 , wherein after the substrate is moved from the first deposition apparatus group, a cleaning process is performed on the substrate. 
   
   
       8 . The operative method of the manufacturing system of  claim 1 , wherein after the substrate is moved from the second deposition apparatus group, a cleaning process is performed on the substrate.