Three-Dimensional Adhesive Device Having a Microelectronic System Embedded Therein

Abstract

Accordingly, the present invention relates to a three-dimensional adhesive device to be attached to the body surface of a mammal comprising a microelectronic sensing system characterized by (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface; (b) a microelectronic system embedded in the body of the pressure sensitive adhesive; (c) one or more cover layer(s) attached to the upper surface; and (d) optionally a release liner releasable attached to the bottom surface of the adhesive device. Suitably the microelectronic system is a microelectronic sensing system capable of sensing physical input such as pressure, vibration, sound, electrical activity (e.g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical properties.

1 : A three-dimensional adhesive device to be attached to the body surface of a
 mammal comprising an microelectronic system characterized by   (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface;   (b) a microelectronic system embedded in the body of the pressure sensitive adhesive;   (c) one or more cover layer(s) attached to the upper surface; and   (d) optionally a release liner releasable attached to the bottom surface of the adhesive device.   
     
     
         2 . An adhesive device according to  claim 1  wherein the micro electronic system is a microelectronic sensing system. 
     
     
         3 . The adhesive device according to  claim 1  wherein the three-dimensional adhesive body has an essentially planar bottom surface adapted to adhere to the body surface of a mammal and an smooth upper surface, the adhesive device being thickest at the central part of the body and thinnest at the periphery of the body. 
     
     
         4 . The adhesive device according to  claim 1  wherein the thickness of the adhesive device at the periphery is less than 50% of the thickness of the adhesive device where it is thickest, suitably the thickness at the periphery is less than 25% of the thickness of the adhesive device where it is thickest, preferred the thickness at the periphery is less than 10% of the thickness of the adhesive device where it is thickest and most preferred the thickness at the periphery is less than 5% of the thickness of the adhesive device where it is thickest. 
     
     
         5 . The adhesive device according to  claim 4  wherein the thickness at the periphery of the adhesive device is more than 0.05 mm, suitably between 0.05 and 0.4 mm and the thickness where the adhesive device is thickest, is between 0.5 and 15 mm, suitably between 1 and 5 mm. 
     
     
         6 . The adhesive device according to  claim 1  wherein the angle between the bottom surface of the adhesive device and a line drawn from any point on the circumference of the and the point at the upper surface where the adhesive body is thickest is below 60 degrees, preferably below 45 degrees and most preferably below 30 degrees. 
     
     
         7 . The adhesive device according to  claim 1  wherein the pressure sensitive adhesive making up the three-dimensional adhesive body is a mouldable thermoplastic pressure sensitive adhesive having a flexibility enabling the adhesive device to conform to the curvature of body parts while retaining its adhesive properties even under movements. 
     
     
         8 . The adhesive device according to  claim 1  wherein the pressure sensitive adhesive is an adhesive based on polymers selected from block-copolymers such as styrene-block-copolymers, and hydrogenated styrene-block-copolymers, amorphous poly-alpha-olefins (APAO), polyacrylics, polyvinylethers, polyurethanes, polyelhylenevinylacetate, silicone, or from the group of hydrogel pressure sensitive adhesives. 
     
     
         9 . The adhesive device according to  claim 8  wherein the block-copolymers such as styrene-block-copolymers, and hydrogenated styrene-block-copolymers is selected from Styrene/ethylene-Butylene/Styrene (SEBS), Styrene/Isoprene/Styrene (SIS), and Styrene/Ethylene-Propylene/Styrene (SEPS). 
     
     
         10 . The adhesive device according to  claim 8  wherein the adhesive is a PolyDiMethylSiloxane based adhesive, such as a PolyDiMethylSiloxane gel. 
     
     
         11 . The adhesive device according to  claim 1  wherein the pressure sensitive adhesive making up the adhesive body comprises hydrocolloids. 
     
     
         12 . The adhesive device according to  claim 1  wherein the pressure sensitive adhesive making up the adhesive body is a foamed adhesive. 
     
     
         13 . The adhesive device according to  claim 1  wherein the entire microelectronic system is integrated in the adhesive body and is completely covered by the adhesive body on all sides. 
     
     
         14 . The adhesive device according to  claim 1  wherein one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body on all sides and the rest of the component(s) of the microelectronic system are located elsewhere in the adhesive body, the components of the microelectronic system having the necessary mechanical and electrical connection to each other. 
     
     
         15 . The adhesive device according to  claim 1  wherein the entire microelectronic system is contained in one or more recesses provided in the upper surface of the adhesive body facing the cover layer(s). 
     
     
         16 . The adhesive device according to  claim 14  wherein one or more components of the microelectronic sensing system is integrated into the adhesive body and is covered by the adhesive body on all sides and the rest of the microelectronic system is contained in one or more recesses provided in the upper surface of the adhesive body facing the cover layer(s). 
     
     
         17 . The adhesive device according to  claim 1  wherein the entire microelectronic system is contained in one or more recesses provided in the adhesive bottom surface of the adhesive body. 
     
     
         18 . The adhesive device according to  claim 14  wherein a one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body at all sides and the rest of the microelectronic sensing system is contained in one or more recesses provided in the adhesive bottom surface of the adhesive body. 
     
     
         19 . The adhesive device according to  claim 1  wherein the entire microelectronic system is contained in one or more through hole(s) in the adhesive body and is accessible from both the upper surface facing the cover layer(s) and the adhesive bottom surface. 
     
     
         20 . The adhesive device according to  claim 14  wherein a one or more components of the microelectronic sensing system is integrated into the adhesive body and is covered by the adhesive body and the rest of the microelectronic system is contained in one or more through hole(s) in the adhesive body and is accessible from both the upper surface facing the cover layer and the adhesive bottom surface. 
     
     
         21 . The adhesive device according to  claim 14  wherein one or more components of the microelectronic system is integrated into the adhesive body and is covered by the adhesive body, other components of the microelectronic system is contained in one or more through holes in the adhesive body and is accessible from both the upper surface facing the cover layer and the adhesive bottom surface, and the rest of the microelectronic system is contained in one or more recesses in the upper and/or bottom surface of the adhesive body. 
     
     
         22 . The adhesive device according to  claim 1  wherein one or more components of the microelectronic system is contained in one or more through holes in the adhesive body and is accessible from both the upper surface facing the cover layer and the adhesive bottom surface and the rest of the microelectronic system is contained in one or more recesses in the upper and/or bottom surface of the adhesive body. 
     
     
         23 . The adhesive device according to  claim 1  wherein one or more components of the micro electronic system is contained in one or more recesses in the upper surface of the adhesive body and the rest of the microelectronic system is contained in one or more recesses in the bottom surface of the adhesive body. 
     
     
         24 . The adhesive device according to  claim 1  wherein the microelectronic system or one or more components thereof is encapsulated in a material different from the adhesive body. 
     
     
         25 . The adhesive device according to  claim 24  wherein the microelectronic system or components thereof is encapsulated in a polymer film, a polymer foil, or a polymer coating or the microelectronic system or components thereof is moulded into a polymer material, or is encapsulated in a glass or ceramic material. 
     
     
         26 . The adhesive device according to  claim 25  wherein the polymer used for encapsulation is silicone rubber. 
     
     
         27 . The adhesive device according to  claim 1  wherein the one or more components of the microelectronic system is accessible from outside the adhesive body, and may be replaced by a similar component during the life time of the adhesive device. 
     
     
         28 . The adhesive device according to  claim 27  wherein the component, which may be exchanged, is the energy source, e.g. the battery. 
     
     
         29 . The adhesive device according to  claim 1  wherein the one or more components of the microelectronic system is accessible from outside the adhesive device, and the component(s) may be reused. 
     
     
         30 . The adhesive device according to  claim 27  wherein the replaceable component(s) or the reusable component(s) is encapsulated and form a package, which fit a recess or a through hole in the adhesive body. 
     
     
         31 . The adhesive device according to  claim 30  wherein the package of encapsulated, replaceable or reusable component(s) is fixed into the adhesive body by a mechanical doubling, suitably snap lock mechanism. 
     
     
         32 . The adhesive device according to  claim 30  wherein the package of encapsulated, replaceable or reusable component(s) is fixed to the surface of the adhesive in the recess or through hole of the adhesive body. 
     
     
         33 . The adhesive device according to  claim 30  wherein the package of encapsulated, replaceable or reusable component(s) is fixed in a recess or through hole in the adhesive body, where said recess or trough hole is provided with an inner non-adhesive surface, such as a PDMS coating. 
     
     
         34 . The adhesive device according to  claim 1  wherein the microelectronic system comprises components selected from communication component(s), CPU, power source, storage component(s), transducer component(s), actuator component(s) and mechanical and/or electrical interconnection between the components. 
     
     
         35 . The adhesive device according to  claim 1  wherein microelectronic system is a system enabling wireless communication. 
     
     
         36 . The adhesive device according to  claim 34  wherein the transducer has a detecting element selected from electrodes (polar, bipolar), a pressure sensor, a needle with an electrode, an accelerometer, a photo detector, a microphone, ISFET, an NTC resistor, a band gab detector, an ion membrane, an enzyme detector or a condenser. 
     
     
         37 . The adhesive device according to  claim 36  wherein the transducer has a non-invasive detecting element, such as electrodes, e.g. steel electrodes. 
     
     
         38 . The adhesive device according to  claim 36  wherein the transducer has an
 invasive detecting element, such as a needle containing an electrode.   
     
     
         39 . The adhesive device according to  claim 34  where there is no physical contact between the detector and the skin of the mammal. 
     
     
         40 . The adhesive device according to  claim 34  wherein the microelectronic system comprises a Network HUB, a gateway or a coordinator system. 
     
     
         41 . The adhesive device according to  claim 34  wherein the microelectronic system includes a GPS. 
     
     
         42 . The adhesive device according to  claim 34  wherein the microelectronic system includes a RFID tag. 
     
     
         43 . The adhesive device according to  claim 40  wherein the microelectronic system is a gateway comprising storage and communication components, CPU and a battery encapsulated in plastic and working as a dedicated network coordinator for transmission of data to a central unit (CU). 
     
     
         44 . The adhesive device according to  claim 41  wherein the microelectronic system is a system selected from:
 a system comprising storage and communication components, CPU, battery, GPS,   components for wireless synchronisation of real time clock for data logging of GPS data   optionally encapsulated in plastic, and
 a system comprising storage and communication components, CPU, battery, GPS, 
   components for wireless synchronisation of real time clock for data logging of GPS data,   mobile net for data logging and transmission of data and position to mobile phones,   optionally encapsulated in plastic,   
     
     
         45 . The adhesive device according to  claim 34  wherein the microelectronic system is useful for nerve stimulation and comprises storage and communication components, CPU, power source and transducer for transmitting data and power to an implant for nerve stimulation. 
     
     
         46 . The adhesive device according to  claim 34  wherein the microelectronic system is a system useful for electromyography and comprises a transducer, CPU, power source, communication and storage components and an optionally an actuator. 
     
     
         47 . The adhesive device according to  claim 1 , wherein the device comprises a power source element for powering said microelectronic system, wherein
 the adhesive body is releasable attached to one or more of the components of the microelectronic system,   the adhesive body has at least a first area for adhering to the body surface, and   
     
     
         48 . The adhesive device according to  claim 47 , wherein the power source element is attached to the adhesive body and the adhesive body has at least a second area for adhering to one or more of the components of the microelectronic system. 
     
     
         49 . The adhesive device according to  claim 48 , wherein a first peel force between the second area and the microelectronic circuit is smaller than a second peel force between the power source and the adhesive body. 
     
     
         50 . The adhesive device according to  claim 47 , wherein the power source element is at least partly contained in the adhesive body. 
     
     
         51 . The adhesive device according to  claim 47 , wherein the adhesive device is adapted to be releasable connectable to a housing containing the microelectronic system and that the housing is formed of a proximal housing part and a distal housing part. 
     
     
         52 . The adhesive device according to  claim 51 , wherein the at least one power source is adapted to be received in a recess, the recess is formed in the distal housing part and that at least one electrical contact is provided in the distal housing providing electrical connection between the power source and the microelectronic circuit. 
     
     
         53 . A sensor assembly adapted to be attached to the body surface of a mammal, comprising
 a sensor circuit, comprising a number of electrical components,   a device comprising at least one power source for powering at least one of the electrical components and at least one adhesive for attaching the sensor assembly to the body surface of a mammal, and   that the device is adapted to be releasable connected to sensor circuit.   
     
     
         54 . A sensor assembly according to  claim 53 , wherein the sensor circuit is at least partly contained in a housing and that the housing is formed of a proximal housing part and a distal housing part. 
     
     
         55 . A sensor assembly according to  claim 54 , wherein a first peel force between the adhesive and the housing is smaller than a second peel force between the adhesive and the battery. 
     
     
         56 . A sensor assembly according to  claim 54 , wherein the at least one transducer is attached to the proximal surface of the proximal part. 
     
     
         57 . A sensor assembly according to  claim 54 , wherein
 a recess is formed in the distal housing part, the recess is adapted to receive the at least one power source, and   at least one electrical contact is provided in the distal housing providing electrical connection between the at least one power source and the electrical components.   
     
     
         58 . A multi-sensor network comprising one or more adhesive devices according to  claim 1 . 
     
     
         59 . A multi-sensor network according to  claim 58  comprising an adhesive device comprising a network coordinator, at least two adhesive devices comprising a microelectronic system useful for electromyography and comprises a transducer, CPU, power source, communication and storage components and an optionally an actuator and adhesive devices comprising a microelectronic system useful for suitable for measuring heart rate. 
     
     
         60 . A method for producing an adhesive device according to  claim 1  having embedded a microelectronic system in an adhesive, said device having a cover film and a release liner characterised by the adhesive body being compression moulded. 
     
     
         61 . A method for producing an adhesive device according to  claim 1  having embedded a microelectronic system in an adhesive, said device having a cover film and a release liner characterised by the adhesive body being injection moulded. 
     
     
         62 . A method for producing an adhesive device according to  claim 1  having embedded a microelectronic system in an adhesive, said device having a cover film and a release liner characterised by the adhesive body being formed by reaction moulding. 
     
     
         63 . An adhesive device according to  claim 1  having embedded a microelectronic system in the adhesive body and being connected to other electronic systems by wiring. 
     
     
         64 . The use of a device comprising an adhesive element and a power source element, and where the device is used for attaching an electronic circuit to a surface and to power said electronic circuit, wherein said electronic circuit is releasable connectable to the adhesive element and the power source element.