Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Abstract

A method of fabricating a semiconductor device, including: preparing a wiring board on which is mounted a first semiconductor chip having a plurality of first pads; electrically connecting each of the first pads to an interconnecting pattern of the first semiconductor chip by a wire; providing resin paste on the first semiconductor chip; mounting a second semiconductor chip having a plurality of second pads on the first semiconductor chip with the resin paste interposed therebetween; and forming a spacer by hardening the resin paste to fix the first and second semiconductor chips together, wherein the spacer is formed to extend under the second pads and further outward; and wherein the highest portion of the wire is disposed on the outer side of the first semiconductor chip.

1 . A method of fabricating a semiconductor device, the method comprising:
 preparing a wiring board having an interconnecting pattern and on which is mounted a first semiconductor chip having a first pad;   electrically connecting the first pad to the interconnecting pattern by a wire; and   providing a resin paste on the first semiconductor chip to make the resin paste flow out over the wiring board from the first semiconductor chip to form a fillet surrounding the first semiconductor chip.   
     
     
         2 . A method of fabricating a semiconductor device, the method comprising:
 preparing a wiring board having an interconnecting pattern and on which is mounted a first semiconductor chip having a first pad;   electrically connecting the first pad to the interconnecting pattern by a wire; and   providing a resin paste on the first semiconductor chip, a portion of the resin paste forming a fillet surrounding the first semiconductor chip.   
     
     
         3 . The method of fabricating a semiconductor device according to  claim 2 , the method further comprising:
 mounting a second semiconductor chip on the first semiconductor chip with the resin paste interposed between the first and second semiconductor chips, the second semiconductor chip having a second pad.   
     
     
         4 . The method of fabricating a semiconductor device according to  claim 2 , the method further comprising:
 mounting a second semiconductor chip on the first semiconductor clip with the resin paste interposed between the first and second semiconductor chips, the second semiconductor chip having a second pad; and   forming a spacer by hardening the resin paste between the first and second semiconductor chips to fix the first and second semiconductor chips together.   
     
     
         5 . The method of fabricating a semiconductor device according to  claim 2 , the method further comprising:
 mounting a second semiconductor chip on the first semiconductor chip with the resin paste interposed between the first and second semiconductor chips, the second semiconductor chip having a second pad; and   forming a spacer by hardening the resin paste between the first and second semiconductor chips to fix the first and second semiconductor chips together, the wire protrudes diagonally upward from a space above the first semiconductor chip.   
     
     
         6 . The method of fabricating a semiconductor device according to  claim 2 , the method further comprising:
 mounting a second semiconductor chip on the first semiconductor chip with the resin paste interposed between the first and second semiconductor chips, the second semiconductor chip having a second pad;   forming a spacer by hardening the resin paste between the first and second semiconductor chips to fix the first and second semiconductor chips together, the wire protrudes diagonally upward from a space above the first semiconductor chip; and   electrically connecting the second pad to the interconnecting pattern by another wire, after hardening the resin paste.   
     
     
         7 . The method of fabricating a semiconductor device according to  claim 2 , the method further comprising:
 mounting a second semiconductor chip on the first semiconductor chip with the resin paste interposed between the first and second semiconductor chips, the second semiconductor chip having a second pad;   forming a spacer by hardening the resin paste between the first and second semiconductor chips to fix the first and second semiconductor chips together; and   forming a sealing portion on the wiring board so as to seal the first and the second semiconductor chips, a space between the first and the second semiconductor chips being filled with at least a part of the sealing portion and the spacer.   
     
     
         8 . The method of fabricating a semiconductor device according to  claim 2 , the method further comprising:
 mounting a second semiconductor chip on the first semiconductor chip with the resin paste interposed between the first and second semiconductor chips, the second semiconductor chip being mounted by controlling a pressure applied to the second semiconductor chip, the second semiconductor chip having a second pad.   
     
     
         9 . The method of fabricating a semiconductor device according to  claim 2 , a height of the resin paste from the wiring board to a top surface of the resin paste being larger than a height of a highest portion of the wire from the wiring board before the step of mounting the second semiconductor chip. 
     
     
         10 . The method of fabricating a semiconductor device according to  claim 2 , the electrically connecting the first pad to the interconnecting pattern including electrically connecting the wire to the interconnecting pattern first and then electrically connecting the wire to the first pad.