Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding

Abstract

In the manufacture of electronic devices ( 22, 22 ′), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool ( 10 ) is used having a bonding tip or wedge ( 1, 2 ) at each of its opposite ends ( 11, 12 ). After extensive use of the wedge-tip ( 1 ) at one end ( 11 ) for bonding wires ( 21 ), the tip ( 1 ) is worn somewhat. Instead of needing to replace the bond tool as in the prior art, the tool ( 10 ) in accordance with the invention is then reversed to use the wedge-tip ( 2 ) at the opposite end ( 12 ) for bonding further wires ( 20 ′). Thus, a cost saving is achieved with regard to tool material.

1 - 3 . (canceled) 
     
     
         4 . A wire-bonding machine for ultrasonic wedge-bonding of wires in the manufacture of electronic devices, wherein the machine includes
 a reversible bonding tool having a wedge-bonding tip at opposite ends of the tool, and   a mount for coupling the tool to an ultrasonic transducer, the mount allowing the tool to be reversed so as to permit wire bonding using either the wedge-bonding tip at one end or the wedge-bonding tip at the opposite end.   
     
     
         5 . A wire-bonding machine according to  claim 4 , wherein the bonding tool comprises a shank having the wedge-bonding tips at opposite ends of the shank, and wherein the mount engages the tool at a position on the shank between its opposite ends. 
     
     
         6 . A reversible bonding tool for use in a machine according to  claim 4  wherein the tool comprises a shank having a wedge-bonding tip at opposite ends of the shank. 
     
     
         7 . A reversible bonding tool for use in a machine according to  claim 4  wherein the tool comprises a shank having at its opposite ends a material which is different to that of the shank and which provides a wedge-bonding tip at each of the opposite ends of the shank. 
     
     
         8 . A machine according to  claim 4 , wherein the wedge-bonding tips at opposite ends are of tungsten carbide. 
     
     
         9 . An electronic device including connections in the form of wires which are wedge-bonded using the machine as recited in  claim 4 . 
     
     
         10 . An electronic device including connections in the form of wires which are wedge-bonded using the tool as recited in  claim 6 . 
     
     
         11 . A wire-bonding machine for ultrasonic wedge-bonding of wires in the manufacture of electronic devices, wherein the machine includes
 a reversible bonding tool having a wedge-bonding tip at opposite ends of the tool,
 wherein the bonding tool further comprises a shank having the wedge-bonding tips at opposite ends of the shank, 
   a mount for coupling the tool to an ultrasonic transducer, the mount allowing the tool to be reversed so as to permit wire bonding using either the wedge-bonding tip at one end or the wedge-bonding tip at the opposite end; and
 wherein the mount engages the tool at a position on the shank between its opposite ends 
   
     
     
         12 . The wire-bonding machine as recited in  claim 11 ,
 wherein the bonding tool comprises a shank having at its opposite ends a material which is different to that of the shank and which provides a wedge-bonding tip at each of the opposite ends of the shank.   
     
     
         13 . The wire-bonding machine as recited in  claim 12 , wherein the wedge-bonding tips at opposite ends are of tungsten carbide.