Electronic devices and methods for forming the same

Abstract

Methods for forming electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the method may include applying materials to a flexible substrate to form the electronic device. At least some of the materials applied to the flexible substrate may be applied using a printing apparatus. The substrate may be annealed when at least some of the materials are present on the flexible substrate. The resulting electronic device may have a high charge carrier mobility in the range from about 10 cm 2 /V-s to about 100 cm 2 /V-s.

1 . A method for forming an electronic device, the method comprising:
 applying materials to a flexible substrate to form an electronic device, wherein at least some of the materials are applied using a printing apparatus; and   annealing the substrate when at least some of the materials reside thereon.   
   
   
       2 . The method as recited in  claim 1 , wherein the electronic device comprises a three terminal device. 
   
   
       3 . The method as recited in  claim 3 , wherein the electronic device has a high charge carrier mobility. 
   
   
       4 . The method as recited in  claim 4 , wherein the charge carrier mobility is in range of from about 10 cm 2 /V-s to about 100 cm 2 /V-s. 
   
   
       5 . The method as recited in  claim 1 , wherein the substrate comprises a silicon material and a flexible stainless steel material. 
   
   
       6 . The method as recited in  claim 5 , wherein the materials include at least one of a dopant, a dielectric, and a conductive material, at least one of which is applied by the printing apparatus. 
   
   
       7 . The method as recited in  claim 6 , wherein the substrate further comprises a gate material, wherein the device includes a first terminal formed by the conductive material and connected to the gate material through an aperture in the dielectric, a second terminal formed by the conductive material and connected to the dopant through an aperture in the dielectric, and a third terminal formed by the conductive material and connected to the dopant through an aperture in the dielectric. 
   
   
       8 . A method of forming a multi-terminal device comprising:
 printing dopant on a substrate having a semiconductor layer to produce a plurality of doped regions within the substrate as part of a multi-terminal device, wherein the doped regions provide a charge carrier mobility of greater than 10 cm 2 /V-s.   
   
   
       9 . The method according to  claim 8 , wherein the doped regions comprise a source and a drain. 
   
   
       10 . The method according to  claim 8 , wherein the multi-terminal device is a transistor having three terminals. 
   
   
       11 . The method according to  claim 8 , wherein the printer comprises an inkjet printing apparatus. 
   
   
       12 . The method according to  claim 8  further comprising annealing the substrate to diffuse dopant into the doped regions.