US2008263845A1PendingUtilityA1

Apparatus and methods for manufacturing operations

Assignee: BOEING COPriority: Sep 5, 2003Filed: Jun 25, 2008Published: Oct 30, 2008
Est. expirySep 5, 2023(expired)· nominal 20-yr term from priority
Y10T408/03B64F 5/50Y10T408/554Y10T408/5647Y10T408/5612B23Q 9/0014Y10T29/5118Y10T29/49778Y10T29/49998Y10T409/306384B64F 5/10Y02P70/50
49
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Claims

Abstract

Techniques of performing a manufacturing operation on a workpiece are disclosed. In one embodiment, a method includes forming an indexing hole in the workpiece. A coordinating pin may be installed into the indexing hole, the coordinating pin including a quantum of indexing information. A sensor may be positioned proximate the coordinating pin. The quantum of indexing information may be sensed with a sensor. A manufacturing operation may be performed on the workpiece based at least partially on the quantum of indexing information.

Claims

exact text as granted — not AI-modified
1 . A method of performing a manufacturing operation on a workpiece, comprising:
 forming an indexing hole in the workpiece;   installing a coordinating pin into the indexing hole, the coordinating pin including a quantum of indexing information;   positioning a sensor proximate the coordinating pin;   sensing the quantum of indexing information with the sensor; and   performing a manufacturing operation on the workpiece based at least partially on the quantum of indexing information.   
   
   
       2 . The method of  claim 1 , wherein installing a coordinating pin into the indexing hole includes installing a coordinating pin having a microchip embedded therein. 
   
   
       3 . The method of  claim 1 , wherein installing a coordinating pin having a quantum of indexing information includes installing a coordinating pin having a unique character string identifier. 
   
   
       4 . The method of  claim 1 , wherein positioning a sensor proximate the coordinating pin includes positioning a sensor at least partially over an end portion of the coordinating pin. 
   
   
       5 . The method of  claim 1 , wherein sensing the quantum of indexing information with the sensor includes contacting the sensor to the coordinating pin. 
   
   
       6 . The method of  claim 1 , wherein performing a manufacturing operation on the workpiece includes performing a drilling operation at the desired location on the workpiece. 
   
   
       7 . The method of  claim 1 , wherein performing a manufacturing operation on the workpiece includes at least one of monitoring workpiece growth, locating workpiece features, positioning sealant application machinery, positioning washing and drying equipment, and obtaining manufacturing plan information. 
   
   
       8 . The method of  claim 1 , further comprising transmitting the quantum of indexing information to a controller. 
   
   
       9 . The method of  claim 1 , further comprising moving a position of a manufacturing tool relative to the workpiece. 
   
   
       10 . The method of  claim 1 , wherein moving a position of a manufacturing tool relative to the workpiece includes moving a position of a manufacturing tool based on the quantum of indexing information. 
   
   
       11 . The method of  claim 1 , wherein moving a position of a manufacturing tool relative to the workpiece includes traversing a carriage assembly along an elongated rail member based on the quantum of indexing information. 
   
   
       12 . A method of performing a manufacturing operation on a workpiece, comprising:
 forming an indexing hole in the workpiece;   installing a coordinating pin into the indexing hole, the coordinating pin including a quantum of indexing information;   positioning a sensor proximate the coordinating pin;   sensing the quantum of indexing information with the sensor;   performing a manufacturing operation on the workpiece based at least partially on the quantum of indexing information;   transmitting the quantum of indexing information to a controller; and   moving a position of a manufacturing tool relative to the workpiece.   
   
   
       13 . The method of  claim 12 , wherein installing a coordinating pin into the indexing hole includes installing a coordinating pin having a microchip embedded therein. 
   
   
       14 . The method of  claim 12 , wherein installing a coordinating pin having a quantum of indexing information includes installing a coordinating pin having a unique character string identifier. 
   
   
       15 . The method of  claim 12 , wherein positioning a sensor proximate the coordinating pin includes positioning a sensor at least partially over an end portion of the coordinating pin. 
   
   
       16 . The method of  claim 12 , wherein sensing the quantum of indexing information with the sensor includes contacting the sensor to the coordinating pin. 
   
   
       17 . The method of  claim 12 , wherein performing a manufacturing operation on the workpiece includes performing a drilling operation at the desired location on the workpiece. 
   
   
       18 . The method of  claim 12 , wherein performing a manufacturing operation on the workpiece includes at least one of monitoring workpiece growth, locating workpiece features, positioning sealant application machinery, positioning washing and drying equipment, and obtaining manufacturing plan information.

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