Connection for Flex Circuit and Rigid Circuit Board

Abstract

Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

1 . An interconnection between circuits, the interconnection comprising:
 a. an upper circuit defining a lower surface and an upper surface, the upper circuit having at least one conductive pad, a relief vent formed through the upper circuit conductive pad extending between the upper and lower surfaces of the upper circuit;   b. a spacer defining upper and lower surfaces, the spacer having at least one aperture alignable to the relief vent of the upper circuit;   c. a lower circuit defining a lower surface and an upper surface, the lower circuit having at least one conductive pad, a relief vent formed through the lower circuit conductive pad extending between the upper and lower surfaces of the lower circuit, the relief vent of the lower circuit being alignable to the aperture of the spacer;   d. solder paste disposed within the aperture of the spacer and between the upper and lower circuits, the solder paste disposed within the relief vents of the upper and lower circuits.