US2008248332A1PendingUtilityA1

Synthetic Resin Card and Method for Producing the Same

Assignee: SONY CORPPriority: Jun 24, 2003Filed: Jun 9, 2008Published: Oct 9, 2008
Est. expiryJun 24, 2023(expired)· nominal 20-yr term from priority
B32B 2250/40B32B 2425/00B32B 2270/00B32B 27/365B32B 2250/244B32B 2307/518B32B 2519/02B42D 25/00B32B 2250/05B32B 27/08B32B 2307/746Y10T428/31855Y10T428/269B32B 27/36Y10T428/24975Y10T428/31938Y10T428/24942Y10T428/2495Y10T428/31797Y10T428/31786Y10T428/24959Y10T428/31504B32B 7/035Y10T428/31935
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Claims

Abstract

A synthetic resin card having a substantially planar core section and a first outer layer and a second outer layer laminated on front and back surfaces of the core section, respectively, the first outer layer and the second outer layer having molecular orientations, the difference Δ in the angle of orientation between the molecular orientations of the first and second outer layers is 20° or less, and at least one of the first and second outer layers is provided with a recording layer.

Claims

exact text as granted — not AI-modified
1 . A synthetic resin card comprising:
 a substantially planar core section; and   a first outer layer and a second outer layer laminated on front and back surfaces of the core section, respectively,   wherein,   the first outer layer and the second outer layer have molecular orientations,   the difference Δ in the angle of orientation between the molecular orientations of the first and second outer layers is 20° or less; and at least one of the first and second outer layers is provided with a recording layer.   
   
   
       2 . The synthetic resin card according to  claim 1 , wherein the thicknesses of the first and second outer layers are symmetrical with respect to the core section. 
   
   
       3 . The synthetic resin card according to  claim 1 , wherein the first and second outer layers each have a thickness of 25 to 125 μm. 
   
   
       4 . The synthetic resin card according to  claim 1 , wherein the first and second outer layers are each formed of a biaxially oriented film. 
   
   
       5 . The synthetic resin card according to  claim 4 , wherein the biaxially oriented film is composed of an oriented PET material. 
   
   
       6 . The synthetic resin card according to  claim 1 , wherein the core section comprises an electronic module sandwiched between a pair of core components. 
   
   
       7 . The synthetic resin card according to  claim 6 , wherein the electronic module comprises an IC chip and an IC module connected to the IC chip. 
   
   
       8 . The synthetic resin card according to  claim 1 , wherein the recording layer comprises a reversible thermosensitive material. 
   
   
       9 . The synthetic resin card according to  claim 1 , wherein the core section is composed of a copolymer of terephthalic acid, cyclohexanedimethanol, and ethylene glycol, and polycarbonate, the compounding ratio of the copolymer being 70% or less. 
   
   
       10 . The synthetic resin card according to  claim 1 , wherein the core section and the first and second outer layers are each composed of a halogen-free material. 
   
   
       11 . A method for producing a synthetic resin card comprising:
 laminating a first outer layer and a second outer layer on front and back surfaces of a substantially planar core section,   wherein,   the first and second outer layers are selected so that the difference Δ in the angle of orientation between the molecular orientations of the first and second outer layers is 20° or less,   the first and second outer layers are laminated so that the thicknesses of the first and second outer layers are symmetrical with respect to the core section, and   a recording layer is formed on at least one of the first outer layer and the second outer layer.

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