Electrolytic processing unit device, and method for electrolytic processing, washing, and drying

Abstract

An electrolytic processing unit device includes an electrolytic processor for performing electrolytic processing on a wafer, a washer for washing the processed wafer, and a drier for drying the wafer. The electrolytic processor, the washer, and the drier are placed in one processing chamber to form one module. In this manner, the electrolytic processing procedure, the washing procedure, and the drying procedure for wafers can be continuously carried out in one place.

1 . An electrolytic processing unit device comprising:
 an electrolytic processor that performs electrolytic processing on a wafer;   a washer that washes the processed wafer; and   a drier that dries the processed or washed wafer,   the electrolytic processor, the washer, and the drier being placed in a processing chamber to form one module that performs the electrolytic processing, washing, and drying for the wafer.   
     
     
         2 . The electrolytic processing unit device according to  claim 1 , wherein the electrolytic processor, the washer, and the drier are aligned on a circular arc or a straight line. 
     
     
         3 . The electrolytic processing unit device according to  claim 1  or  2 , wherein the electrolytic processor, the washer, and the drier form one module, and are connected to each other by one transportation system. 
     
     
         4 . The electrolytic processing unit device according to any of  claims 1  through  3 , wherein the electrolytic processor, the washer, and the drier that carry out the above series of procedures are controlled, operated, and subjected to maintenance independently of one another. 
     
     
         5 . The electrolytic processing unit device according to  claim 1  or  2 , wherein a beveling unit for beveling an outer peripheral portion of the wafer after the electrolytic processing is provided in the vicinity of the electrolytic processor. 
     
     
         6 . The electrolytic processing unit device according to any of  claims 1 ,  3 , and  4 , wherein
 the module includes: an access area through which wafers are brought in and out; an electrolytic processing head for electrolytic processing that is provided in a different area from the access area, and a holding arm that holds the electrolytic processing head; and   a washing arm that supports a wafer washing unit is provided in the opposite position from the holding arm.   
     
     
         7 . The electrolytic processing unit device according to  claim 6 , wherein the wafer washing unit in the module includes a washing brush, a ultrasonic water supplier, and a nitrogen blower. 
     
     
         8 . An electrolytic processing unit device comprising:
 an electrolytic processor that performs electrolytic processing on a wafer;   a washer that washes the processed wafer; and   a drier that dries the processed or washed wafer,   the electrolytic processor, the washer, and the drier being placed in a processing chamber to form one module that performs the electrolytic processing, washing, and drying for the wafer,   an electrode portion for the electrolytic processing being made of an inorganic material.   
     
     
         9 . A method for electrolytic processing, washing, and drying in a structure having a wafer chuck mechanism, comprising the steps of:
 performing electrolytic processing by applying a voltage between an electrode having edges clamped around a wafer and an electrolytic processing head that scans the surface of the wafer, after securing the wafer;   polishing a conductive film at an edge portion in the same position, if necessary, while a bottom face of the wafer is being sucked and fixed after an edge clamp is removed;   scanning the surface of the wafer with a washing arm in the same position, a washing unit being attached to the washing arm;   washing the processed wafer; and   drying the processed or washed wafer in the same position.   
     
     
         10 . The method according to  claim 9 , wherein the surface of the wafer and an electrode portion are rinsed with pure water, after the electrolytic processing procedure and the washing procedure.