Vent groove modified sputter target assembly and apparatus containing same

Abstract

A sputter target assembly including vent grooves having a certain configuration so as to reduce target arcing during the physical vapor deposition of a film.

1 . A sealing configuration of a physical vapor deposition system, comprising:
 a track adapted to receive a sealing member, the track having a plurality of vent grooves configured in a semi-spherical or semi-circular fashion to allow the removal of substantially all trapped gases in the track during the pump-down of the physical vapor deposition system in order to achieve a vacuum therein, and reduce or eliminate arcing of the target during subsequent plasma processing.   
   
   
       2 . The sealing configuration of  claim 1 , wherein the vent grooves have a variable configuration in both the vertical and horizontal plane. 
   
   
       3 . The sealing configuration of  claim 1 , further comprising: at least four vent grooves disposed at approximately equal distance from one another on the periphery of the track. 
   
   
       4 . The sealing configuration of  claim 1 , wherein the sealing member is an o-ring. 
   
   
       5 . The sealing configuration of  claim 1 , wherein the sealing member provides an adequate seal between the target backing plate and the sidewall of a process chamber in said physical vapor deposition system. 
   
   
       6 . The sealing configuration of  claim 1 , wherein the vent grooves are machined to a dimension of 0.200 inches in diameter and a depth of about 0.080 inches. 
   
   
       7 . The sealing configuration of  claim 1 , wherein the vent grooves are disposed at a 45° angle between the track's inner diameter and the target side wall. 
   
   
       8 . A sputter target assembly of a physical vapor deposition system, the sputter target assembly comprising:
 a target backing plate that includes a sealing surface, the sealing surface including a track adapted to receive a sealing member, the track including a number of openings configured in a semi-spherical or semi-circular fashion to allow the removal of substantially all trapped gases in the groove during the pump-down of the physical vapor deposition system in order to achieve a vacuum therein, and reduce or eliminate arcing of the target during subsequent plasma processing; and   a sputter target connected to the backing plate.   
   
   
       9 . The sputter target assembly of  claim 8 , wherein the openings have a variable configuration in both the vertical and horizontal plane. 
   
   
       10 . The sputter target assembly of  claim 8 , further comprising: at least four openings are disposed at approximately equal distance from one another on the periphery of the track. 
   
   
       11 . The sputter target assembly of  claim 8 , wherein the sealing member is an o-ring. 
   
   
       12 . The sputter target assembly of  claim 8 , wherein the sealing member provides an adequate seal between the target backing plate and the sidewall of a process chamber in said physical vapor deposition system. 
   
   
       13 . The sputter target assembly of  claim 8 , wherein the openings are machined to a dimension of 0.200 inches in diameter and a depth of about 0.080 inches. 
   
   
       14 . The sputter target assembly of  claim 8 , wherein the openings are disposed at a 45° angle between the track's inner diameter and the target side wall.