Intermediate probe structures for atomic force microscopy

Abstract

An intermediate probe structure for atomic force microscopy is disclosed. The probe structure comprises a semiconductor substrate with one or more moulds formed on a surface of one side of the substrate. The probe structure further comprises one or more probe configurations formed on the one side of the semiconductor substrate, wherein each probe configuration comprises a contact region and at least one set of a probe tip and a cantilever. The probe structure further comprises one or more holders attached to each of the contact regions, wherein the surface area of each contact region is smaller in size than the surface area of the holder which is attached to the contact region.

1 . An intermediate probe structure for atomic force microscopy, comprising:
 a semiconductor substrate with one or more moulds formed on a surface of one side of the substrate;   one or more probe configurations formed on the one side of the semiconductor substrate, wherein each probe configuration comprises a contact region and at least one set of a probe tip and a cantilever, and wherein each contact region comprises one or more bonding pads; and   one or more holders attached to each of the contact regions, wherein a combined surface area of the plurality of bonding pads is smaller than a surface area of the holder which is attached to the bonding pads, and wherein a height of the bonding pads is sufficient to allow a release chemical to flow into a gap formed on the one side of the substrate between the holder and the substrate.   
     
     
         2 . The intermediate probe structure of  claim 1 , wherein the holder comprises a plurality of holes configured to allow release chemical to reach the contact region, and wherein the contact region comprises a number of openings, which are aligned with the holes in the holder to allow under-etching of the probe configuration. 
     
     
         3 . The intermediate probe structure of  claim 1 , wherein the one or more holders is a holder substrate attached to the semiconductor substrate comprising a plurality of probe configurations, wherein the holder substrate is configured to be diced to form individual holders. 
     
     
         4 . An intermediate probe structure for atomic force microscopy, comprising:
 a semiconductor substrate with one or more moulds formed on a surface of one side of the substrate;   one or more probe configurations formed on the one side of the semiconductor substrate, wherein each probe configuration comprises a contact region and at least one set of a probe tip and a cantilever; and   one or more holders attached to each of the contact regions, wherein the surface area of each contact region is smaller in size than the surface area of the holder which is attached to the contact region.   
     
     
         5 . The intermediate probe structure of  claim 4 , wherein at least a portion of the contact region is separate from the probe tip and the cantilever. 
     
     
         6 . The intermediate probe structure of  claim 4 , wherein the holder comprises a plurality of holes configured to allow release chemical to reach the contact region, and wherein the contact region comprises a number of openings, which are aligned with the holes in the holder to allow under-etching of the probe configuration. 
     
     
         7 . The intermediate probe structure of  claim 4 , wherein the holder comprises a plurality of holes configured to allow release chemical to reach the contact region, and wherein the contact region comprises a number of openings, which are aligned with the holes in the holder to allow under-etching of the probe configuration from only the one side of the substrate on which the probe configuration is formed. 
     
     
         8 . The intermediate probe structure of  claim 4 , wherein the holders are attached to each contact region by a boding layer located therebetween. 
     
     
         9 . The intermediate probe structure of  claim 8 , wherein the combined height of the contact region and the bonding layer is sufficient to create a gap between the holder and the substrate, so as to allow release chemical to flow between the holder and the substrate. 
     
     
         10 . The intermediate probe structure of  claim 4 , wherein the height of the contact region is sufficient to create a gap between the holder and the substrate, so as to allow release chemical to flow between the holder and the substrate. 
     
     
         11 . The intermediate probe structure of  claim 4 , wherein the holder is attached through the attachment of a holder substrate to a substrate comprising a plurality of probe configurations, and wherein the holder substrate is diced to form individual holders. 
     
     
         12 . The intermediate probe structure of  claim 1 , wherein the contact region comprises one or more bonding pads, wherein the total surface area of the pads is smaller in size than the surface area of the holder which is to be attached to the pads. 
     
     
         13 . The intermediate probe structure of  claim 12 , wherein the pads are elongated and channels are formed between neighbouring pads. 
     
     
         14 . The intermediate probe structure of  claim 12 , wherein a height of the bonding pads is sufficient to allow a release chemical to flow into a gap formed on the one side of the substrate between the holder and the substrate.