US2008225498A1PendingUtilityA1

Adapter for a memory card and a memory card

Assignee: RENESAS TEACHNOLOGY CORPPriority: Feb 28, 2005Filed: May 23, 2008Published: Sep 18, 2008
Est. expiryFeb 28, 2025(expired)· nominal 20-yr term from priority
A47L 19/02H10W 90/24H10W 72/5522H01R 12/714H05K 1/117H01R 2201/20H05K 1/142G06K 19/07743H01R 12/7005H01R 31/06G06K 19/07739H05K 3/326H01R 27/00
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Claims

Abstract

An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

Claims

exact text as granted — not AI-modified
1 - 15 . (canceled) 
   
   
       16 . A memory card comprising:
 a wiring substrate having a first surface and a second surface which are disposed on mutually opposite sides in the thickness direction of the wiring substrate;   a semiconductor chip mounted on the first surface of the wiring substrate and having a memory circuit which contributes to the storage of information;   a first resin sealing body for sealing the semiconductor chip;   a first housing provided on the first surface side of the wiring substrate so as to cover the first surface of the wiring substrate and also cover the first resin body;   an electronic part mounted on the second surface of the wiring substrate;   a second resin sealing body for sealing the electronic part;   a plurality of external terminals formed on the second surface side of the wiring substrate at a position spaced away from the second resin sealing body and connected electrically to the semiconductor chip and the electronic part; and   a second housing provided on the second surface of the wiring substrate so as to cover the second resin sealing body at a position spaced away from the area where the plurality of the external terminals are disposed to let the external terminals be exposed to the exterior,   wherein the thickness of the memory card portion where the second housing is provided is larger than the thickness of the memory card portion where the plurality of the external terminals are disposed.   
   
   
       17 . A memory card according to  claim 16 , wherein the plurality of the external terminals are disposed in two rows in a direction of insertion of the memory card into an electronic device. 
   
   
       18 . A memory card according to  claim 16 , wherein the electronic part is a semiconductor chip, the semiconductor chip having a control circuit for controlling the operation of the semiconductor chip having the memory circuit which contributes to the storage of information. 
   
   
       19 . A memory card according to  claim 16 , wherein the electronic part is a passive element. 
   
   
       20 . A memory card according to  claim 19 , wherein the passive element is a pull-up resistor. 
   
   
       21 . A memory card comprising:
 a wiring substrate having a first surface and a second surface which are disposed on mutually opposite sides in the thickness direction of the wiring substrate;   a semiconductor chip mounted on the first surface of the wiring substrate and having a memory circuit which contributes to the storage of information;   a first resin sealing body for sealing the semiconductor chip;   a first housing provided on the first surface side of the wiring substrate so as to cover the first surface of the wiring substrate and also cover the first resin sealing body;   an electronic part mounted on the second surface of the wiring substrate;   a second resin sealing body for sealing the electronic part, the second resin sealing body being formed in an exposed state to the exterior; and   a plurality of external terminals formed on the second surface side of the wiring substrate at a position spaced away from the second resin sealing body and connected electrically to the semiconductor chip and the electronic part,   wherein the thickness of the memory card portion where the second resin sealing body is provided is larger than the thickness of the memory card portion where the plurality of the external terminals are disposed.   
   
   
       22 . A memory card according to  claim 21 , wherein the plurality of the external terminals are disposed in two rows in a direction of insertion of the memory card into an electronic device.

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