US2008224169A1PendingUtilityA1

Submount for diode with single bottom electrode

Assignee: WU JIAHN-CHANGPriority: May 18, 2004Filed: May 30, 2008Published: Sep 18, 2008
Est. expiryMay 18, 2024(expired)· nominal 20-yr term from priority
Inventors:Jiahn-Chang Wu
H05K 1/112H10W 90/754H10W 90/734H10W 90/724H10W 72/9415H10W 72/07554H10W 72/884H10W 72/547H10W 72/90H10H 20/857H10H 20/8506
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Claims

Abstract

A submount is used to mount a diode between two metal areas on the upper surface of a substrate. One of the areas is connected to a metal plate at the lower surface of the substrate through a via. The submount is clamped between two metal sheets. The top metal sheet has a through-hole for anchoring and self-aligning the diode. The electrodes of the diode are each coupled to one of the clamping metal sheets. Clamping metals provide pressure contact without soldering to the contact. But soldering can be alternatively used to enhance product reliability. Either the top metal sheet or the bottom metal sheet can be fully or selectively coating of solder for batch soldering at the contact point upon heating. The large metal plates and the large metal clamping sheets provide good heat sink and speedy soldering.

Claims

exact text as granted — not AI-modified
1 . A display module with a submount for a diode, comprising:
 a substrate;   a first upper metal area on a top surface of said substrate;   a second upper metal area on a top surface of said substrate encircling the first upper metal area;   a lower metal area covering a bottom surface of said substrate;   an electrically conducting conduit, coupling said first upper metal area with said lower metal area;   a diode chip having a first electrode and a second electrode electrically coupling respectively to said first upper metal area and said second upper metal area;   a top metal sheet, having a through hole to anchor said diode chip, electrically coupling to said second upper metal area; and   a bottom metal sheet, below said diode chip, electrically coupling to said lower metal area.   
   
   
       2 . The module as described in  claim 1 , further comprising a transparent material to cover said through-hole. 
   
   
       3 . The module as described in  claim 1 , further comprising a protective glue to cover said diode chip. 
   
   
       4 . The module as described in  claim 1 , wherein the top metal sheet is of zigzag metal, the zigzag metal having a lower section which having a bottom surface coplanar with a bottom surface of said bottom metal sheet.

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