Single-chip surface mounted led structure and a method for manufacturing the same

Abstract

A single-chip surface mounted LED structure and a method for manufacturing the same, said LED structure mainly comprises an LED chip, a heat sink structure, two opposing electrodes, conducting wires and a supporting structure; said method comprises the steps of firstly cutting off a spare area other than said heat sink structure and two opposing electrodes from a metal material belt, forming a basic shape, forming said supporting structure in the region of said heat sink structure and two opposing electrodes using plastic injection molding, and then further cutting off the rest of said metal material belt to separate said heat sink structure and two opposing electrodes, and finally using chip-bonding and wire bonding to package sad LED structure and cutting off said packaged LED structure from said metal material belt.

1 . A method for manufacturing a single-chip surface mounted LED structure, comprises the following steps:
 Step  1 : using a first knife mold to cut off a spare area other than those which form a heat sink structure and two opposing electrodes on a metal material belt to form a basic shape for said heat sink structure and said two opposing electrodes on said metal material belt;   Step  2 : using a plastic mold injection method to form a support structure on said metal material belt, wherein said support structure is formed at least in the range of said heat sink structure and said two opposing electrodes;   Step  3 : using a second knife mold to cut off a connection area of said heat sink structure and said two opposing electrodes on said metal material belt to let said heat sink structure and said two opposing electrodes connected by said support structure, and said heat sink structure and said metal material belt being connected by only a connecting point;   Step  4 : implementing wire bonding and chip bonding on said metal material belt having said basic shape and packaging said single-chip surface mounted LED structure; and   Step  5 : cutting off said connecting point to separate said single-chip surface mounted LED structure from said metal material belt.   
   
   
       2 . The method of  claim 1 , wherein said support structure is disposed by mold injection. 
   
   
       3 . A single-chip surface mounted LED structure, comprises:
 an LED chip as a light source;   two opposing electrodes disposed at sides of said LED chip;   two conducting wires extending from said LED chip to connect to two opposing electrodes respectively;   a heat sink structure supporting an end of said LED chip to dissipate the heat from said LED chip; and   a support structure connecting to said heat sink structure and said two opposing electrodes.   
   
   
       4 . The single-chip surface mounted LED structure of  claim 3 , wherein said heat sink structure can combine other heat dissipating device to provide more efficient heat dissipating effect. 
   
   
       5 . The single-chip surface mounted LED structure of  claim 3 , wherein said heat sink structure can be bent into various shapes to achieve the most heat dissipating effect. 
   
   
       6 . The single-chip surface mounted LED structure of  claim 3 , wherein said heat sink structure has adjustable area to achieve the most heat dissipating effect. 
   
   
       7 . The single-chip surface mounted LED structure of  claim 3 , wherein said heat sink structure and said two opposing electrodes are formed on said metal material belt at the same time.