Wiring board and method of manufacturing wiring board

Abstract

A wiring board including a plated through hole provided on the wiring board, and an indicator provided around the plated through hole. The indicator indicating a processing state related to the plated through hole.

1 . A wiring board, comprising:
 a plated through hole provided on the wiring board; and   an indicator provided around the plated through hole, indicating a processing state related to the plated through hole.   
   
   
       2 . The wiring board according to  claim 1 , wherein the indicator has an annulus ring shape and comprises a central axis corresponding to a central axis of the plated through hole, and a circumference of the indicator having the annulus ring shape is included in a countersunk area where the plated through hole is removed. 
   
   
       3 . The wiring board according to  claim 1 , wherein the indicator is a pattern formed with coloring materials. 
   
   
       4 . The wiring board according to  claim 1 , wherein the indicator comprises an internal axis corresponding to an internal axis of the plated through hole, and a circumference of the indicator has a plurality of patterns continuously provided in an annulus ring-shaped area included in a countersunk area where the plated through hole is removed. 
   
   
       5 . The wiring board according to  claim 1 , wherein the indicator comprises an internal axis corresponding to an internal axis of the plated through hole, and an annulus ring shape whose internal diameter is bigger than a countersunk area where the plated through hole is removed. 
   
   
       6 . The wiring board according to  claim 5 , further comprising a processing hole formed in a position where the plated through hole is formed, and the plated through hole is exposed at a bottom. 
   
   
       7 . The wiring board according to  claim 1 , wherein the indicator comprises an internal axis corresponding to an internal axis of the plated through hole, and an inner circumference has a plurality of patterns continuously provided in an annulus ring-shaped area whose diameter is bigger than a countersunk area where the plated through hole is removed. 
   
   
       8 . The wiring board according to  claim 1 , wherein the indicator is a pattern of conductive materials. 
   
   
       9 . The wiring board according to  claim 8 , wherein the pattern of conductive materials is formed into one pattern with the same material as that of the plated through hole. 
   
   
       10 . A method of manufacturing a wiring board, the method comprising:
 forming a plated through hole in the board;   forming an indicator around the plated through hole on a surface of the board, the indicator can be checked visually; and   forming a processing hole by removing a part of the plated through hole in the indicator together with the wiring board nearby.   
   
   
       11 . The method of manufacturing a wiring board according to  claim 10 , wherein the forming the processing hole comprises removing at least a portion of the indicator, and the method further comprising:
 checking a level of remaining indicator after the indicator is removed during forming the processing hole; and   determining a removing state of the plated through hole by the result of the checking.   
   
   
       12 . The method of manufacturing a wiring board according to  claim 10 , wherein the forming the indicator comprises forming the indicator as a pattern formed with coloring materials. 
   
   
       13 . The method of manufacturing a wiring board according to  10 , wherein the forming the indicator and the forming the plated through hole are performed at the same time. 
   
   
       14 . The method of manufacturing a wiring board according to  claim 10 , wherein the forming the indictor comprises forming a pattern of conductive materials into one with the same material as that of the plated through hole.