US2008216992A1PendingUtilityA1

Heat dissipating device

Assignee: FAN CHIANG LI-WEIPriority: Mar 14, 2006Filed: May 14, 2008Published: Sep 11, 2008
Est. expiryMar 14, 2026(expired)· nominal 20-yr term from priority
H10W 40/226F28F 3/02
34
PatentIndex Score
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Claims

Abstract

A heat dissipating comprising: a plurality of fins; an upper side and a lower side of each fin being folded with folding sheets; each of two sides of each sheet being protruded with a buckling ear; the buckling ear having a T shape; a hole being formed on the folding sheet and being located behind the buckling ear; the shape of the hole being corresponding to that of the buckling ear; a tenon being formed at two lateral walls of the hole and a middle section of the tenon being protruded with a semi-round section. In assembly, the buckling ears of one fin are buckled to the holes of another fin so as to assembly two fins together; the tenon serves to buckle the buckling ear to the hole; more fins are assembled by the same way; the heat dissipating device can be assembled to a computer central processing unit.

Claims

exact text as granted — not AI-modified
1 . A heat dissipating comprising:
 a plurality of fins; an upper side and a lower side of each fin being folded with folding sheets; each of two sides of each sheet being protruded with a buckling ear; the buckling ear having a T shape; a hole being formed on the folding sheet and being located behind the buckling ear; the shape of the hole being corresponding to that of the buckling ear; a tenon being formed at two lateral walls of the hole and a middle section of the tenon being protruded with a semi-round section;   wherein in assembly, the buckling ears of one fin are buckled to the holes of another fin so as to assembly two fins together; the tenon serves to buckle the buckling ear to the hole; more fins are assembled by the same way; the heat dissipating device can be assembled to a computer central processing unit.

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