Method of Surface Treatment and Surface-Treated Article

Abstract

Plasma generated in water vapor bubbles present in a water-containing liquid is brought into contact, in the liquid, with an article having a contact angle with water of 90° or less. The plasma is contacted with an organic substance adhering to the article to thereby remove the organic substance from the article. By bringing the plasma into contact with the article, the surface of the article is etched without breaking the article. The article may comprise a material composed of both a hydrophobic part having a contact angle with water exceeding 90° and a hydrophilic part having a contact angle with water of 90° or less. In this case only the hydrophobic part is etched by bringing the plasma into contact with the article.

1 . A method of surface treatment comprising:
 contacting plasma generated in water vapor bubbles in a liquid comprising water to a material having a contact angle to water of 90° or less in the liquid.   
   
   
       2 . An article surface-treated by the method of surface treatment according to  claim 1 . 
   
   
       3 . A method of surface treatment comprising:
 contacting plasma generated in water vapor bubbles in a liquid comprising water to organic substances adhering to a material having a contact angle to water of 90° or less in the liquid comprising water to remove the organic substances.   
   
   
       4 . The method of surface treatment according to  claim 3 , wherein the material having a contact angle to water of 90° or less is a polymer porous membrane. 
   
   
       5 . The method of surface treatment according to  claim 3 , wherein the material having a contact angle to water of 90° or less is a polymer electrolytic membrane. 
   
   
       6 . The method of surface treatment according to  claim 3 , wherein the material having a contact angle to water of 90° or less is a glass. 
   
   
       7 . The method of surface treatment according to  claim 3 , wherein the material having a contact angle to water of 90° or less is a ceramic. 
   
   
       8 . An article surface-treated by the method of surface treatment according to  claim 3 . 
   
   
       9 . An etching process comprising:
 contacting plasma generated in water vapor bubbles in a liquid comprising water to a material having a contact angle to water of 90° or less in the liquid comprising water to etch a surface of the material without breaking.   
   
   
       10 . The etching process according to  claim 9 , wherein the material having a contact angle to water of 90° or less is a metal. 
   
   
       11 . The etching process according to  claim 10 , wherein the metal is at least one selected from the group consisting of copper, aluminum, and tungsten. 
   
   
       12 . An article etched by the etching process according to  claim 9 . 
   
   
       13 . An etching process comprising:
 contacting plasma generated in water vapor bubbles in a liquid comprising water to a material comprising both a hydrophobic part having a contact angle to water of more than 90° and a hydrophilic part having a contact angle to water of 90° or less in the liquid comprising water to etch the hydrophobic part.   
   
   
       14 . An article etched by the etching process according to  claim 13 .