Processing Method for Glass Substrate, Processed Glass Product and Stress Applying Apparatus

Abstract

A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof; and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate.

1 - 25 . (canceled) 
     
     
         26 . A stress applying apparatus comprising:
 an indenter which applies an external force by pressing, or by pressing and sweeping a surface of a glass substrate or a film formed on said glass substrate so as to form a compression stressed part of a desired shape;
 a heat source which heats said indenter; 
 a driving device which moves at least one of said indenter and said glass substrate; and 
   a controller which controls said driving device and said heat source.   
     
     
         27 . The stress applying apparatus according to  claim 26 , wherein an end of said indenter is in the shape of a part of a sphere. 
     
     
         28 . The stress applying apparatus according to  claim 26 , wherein an end of said indenter is in a knife edge shape. 
     
     
         29 . The stress applying apparatus according to  claim 26 , wherein said indenter is multiply shaped. 
     
     
         30 . The stress applying apparatus according to  claim 26 , wherein the material of said indenter is harder than the material of the surface of said glass substrate or the material of said film formed on said glass substrate, to which said external force is applied. 
     
     
         31 . A stress applying apparatus comprising:
 a mold which applies an external force by pressing a surface of a glass substrate or a film formed on said glass substrate so as to form a compression stressed part of a desired shape;   a heat source which heats said mold;   a driving device which moves at least one of said mold and said glass substrate; and   a controller which controls said driving device and said heat source.   
     
     
         32 . The stress applying apparatus according to  claim 31 , wherein the material of said mold is harder than the material of the surface of said glass substrate or the material of said film formed on said glass substrate, to which said external force is applied. 
     
     
         33 . A stress applying apparatus comprising:
 a particle ejecting device which ejects particles a surface of a glass substrate or a film formed on said glass substrate so as to form a compression stressed part of a desired shape;   a heat source which heats said particles;   a driving device which moves at least one of said particle ejecting device and said glass substrate; and   a controller which controls said driving device and said heat source.   
     
     
         34 . The stress applying apparatus according to  claim 33 , wherein the material of said particles is harder than the material of the surface of said glass substrate or the material of said film formed on said glass substrate, to which said external force is applied. 
     
     
         35 . The stress applying apparatus according to any one of  claims 26 ,  31 , and  33 , further comprising a gas supply device which supplies an inert gas into a chamber accommodating said glass substrate.