Manufacturing method of products attached with rfid label in a mold

Abstract

A manufacturing method of products attached with a RFID label in a mold includes a first step of forming a thin substratum by injecting molding, pushing molding, vacuum molding, blowing molding or sword molding in a first mold, a second step of making a substratum label composed of the substratum and an RFID label adhered with the substratum, and a third step of placing the substratum label in a second mold, in which a plastic product is to be formed and also to be attached with the substratum label inside the product during molding process. Thus, protected by the substratum and the plastic product. The RFID cannot be broken or damaged to always maintain its capacity to be identified, with the plastic product enhanced in its value.

1 . A manufacturing method of a product attached with an RFID label in a mold, said method comprising:
 a first step of preparing a first mold for molding a substratum;   a second step of preparing a RFID (radio frequency identification device) label by arranging an RFID chip and an antenna on a circuit board and attaching said RFfl) label on said substratum to become a substratum label; and,   a third step of preparing a second mold, placing said substratum label in said second mold, and injecting a plastic material into said second mold to form said product, wherein the injected plastic material is exposed to inner sidewalls of the second mold, and the product is formed mainly by the injected plastic material.   
   
   
       2 . The manufacturing method as claimed in  claim 1 , wherein said substratum is made by means of injecting molding, pushing molding, vacuum molding, pressing molding or sword molding. 
   
   
       3 . The manufacturing method as claimed in  claim 1 , wherein said substratum is made of the same material as that of said product. 
   
   
       4 . The manufacturing method as claimed in  claim 1 , wherein said substratum is made of a different material from that of said product. 
   
   
       5 . The manufacturing method as claimed in  claim 1 , wherein said substratum is a thin film, a thin plate, a foam thin plate or a compound plate. 
   
   
       6 . The manufacturing method as claimed in  claim 1 , wherein said RFID label has an adhesive layer on one side for combining with said substratum. 
   
   
       7 . The manufacturing method as claimed in  claim 1 , wherein said RFID label is combined with said substratum with an adhesive film. 
   
   
       8 . The manufacturing method as claimed in  claim 1 , wherein said RFID label is combined with said substratum by means of high frequency process. 
   
   
       9 . The manufacturing method as claimed in  claim 1 , wherein said RFID label is combined with said substratum by means of supersonic. 
   
   
       10 . The manufacturing method as claimed in  claim 1 , wherein said RFID label is of any shape. 
   
   
       11 . The manufacturing method as claimed in  claim 1 , wherein said RFID label is provided with a print layer, and a linking layer is provided in said print layer, having the same material as that of said product. 
   
   
       12 . (canceled) 
   
   
       13 . A manufacturing method of a product attached with an RFID label in a mold, said method comprising:
 providing a first mold and a second mold positioned on a rotatable base;   molding a substratum in the first mold while the first mold is located at a predetermined first location and the second mold is located at a predetermined second location;   bringing the first mold to the predetermined second location by rotating the rotatable base, which in turn brings the second mold to the predetermined first location;   attaching a RFID (radio frequency identification device) label which includes an RFID chip and an antenna on a circuit board on the substratum to form a substratum label;   injecting a plastic material into the first mold with the substratum label to form the product attached with the substratum label;   molding a substratum in the second mold while the second mold is located at the predetermined first location and the first mold is located at the predetermined second location;   bringing the second mold back to the predetermined second location by rotating the rotatable base, which in turn brings the first mold back to the predetermined first location;   attaching a RFID (radio frequency identification device) label which includes an RFID chip and an antenna on a circuit board on the substratum to form a substratum label;   injecting a plastic material into the second mold with the substratum label to form the product attached with the substratum label;   removing the product attached with the substratum label; and   repeating the above steps.   
   
   
       14 . The manufacturing method as claimed in  claim 13 , wherein the RFID label is attached on the substratum while the first mold or the second mold is located at the predetermined second location. 
   
   
       15 . The manufacturing method as claimed in  claim 13 , wherein the first mold and the second mold have the same size and shape. 
   
   
       16 . The manufacturing method as claimed in  claim 13 , wherein the injected plastic material is exposed to inner sidewalls of the second mold, and the product is formed mainly by the injected plastic material.