Chip package with transceiver front-end

Abstract

Various embodiments describe a chip package having a transceiver front-end. The transceiver front-end may be coupled to a communication processor on a die disposed on the chip package. Other embodiments may be described and claimed.

1 . An apparatus, comprising:
 a chip package having a plurality of transceiver front-ends, each of the plurality of transceiver front ends having one or more passive components implemented by one or more trace structures disposed on one or more layers of the chip package; and   a die disposed on said chip package and having a plurality of communication processors, each of the plurality of communication processors coupled to a respective transceiver front end of the plurality of transceiver front-ends.   
   
   
       2 . The apparatus of  claim 1 , wherein at least one of the plurality of communication processors includes physical layer circuitry to implement a modulation or a demodulation scheme. 
   
   
       3 . The apparatus of  claim 1 , wherein at least one of the plurality of communication processors includes a memory layer to interface with a general purpose processor disposed on said die. 
   
   
       4 . The apparatus of  claim 1 , wherein at least one of the plurality of communication processors includes a sublayer to identify whether a packet is intended for the corresponding communications processor. 
   
   
       5 . The apparatus of  claim 1 , wherein a first communication processor of the plurality of communication processors includes a sublayer to identify whether a packet is intended for the first communication processor, said first communication processor to operate in a lower power mode by being powered down until said sublayer identifies a packet intended for the first communication processor. 
   
   
       6 . The apparatus of  claim 1 , wherein said chip package is a flip-chip package. 
   
   
       7 . The apparatus of  claim 1 , further comprising an antenna to couple with each of the plurality of transceiver front-ends. 
   
   
       8 . The apparatus of  claim 1 , wherein the one or more passive components of at least one of the plurality of transceiver front-ends includes a switch. 
   
   
       9 . The apparatus of  claim 8 , wherein the switch includes a matching network. 
   
   
       10 . The apparatus of  claim 8 , wherein the switch includes an impedance transformer and radio frequency (RF) choke. 
   
   
       11 . The apparatus of  claim 8 , wherein the switch includes a quarter-wavelength stripline 
   
   
       12 . The apparatus of  claim 1 , further comprising:
 a heat spreader coupled to said chip package; and   an antenna coupled with at least one of the plurality of transceiver front-ends and disposed on the heat spreader.   
   
   
       13 . The apparatus of  claim 1 , wherein the chip package is a multi-layered chip package and at least a first one of the plurality of transceiver front-ends includes one or more passive components implemented by a plurality of trace structures disposed on a plurality of layers of the chip package. 
   
   
       14 . The apparatus of  claim 10 , further comprising:
 a circuit board having the multi-layered chip package disposed thereon.   
   
   
       15 . An apparatus comprising:
 a package having a plurality of layers;   a die disposed on said package and having a communication processor; and   one or more passive components of a transceiver front-end implemented by one or more trace structures disposed on at least two layers of the plurality of layers of the package and coupled to the communication processor.   
   
   
       16 . The apparatus of  claim 15 , wherein the one or more passive components comprise:
 an impedance transformer and a radio-frequency choke disposed on a first layer of the at least two layers of the package.   
   
   
       17 . The apparatus of  claim 16 , wherein the impedance transformer includes a tapered microstrip structure. 
   
   
       18 . The apparatus of  claim 16 , wherein the one or more passive components further comprise:
 a quarter-wavelength stripline disposed on a second layer of the at least two layers of the package.   
   
   
       19 . The apparatus of  claim 15 , further comprising:
 an antenna structure coupled to the one or more passive components; and   a heat spreader having the antenna structure disposed thereon.   
   
   
       20 . The apparatus of  claim 15 , wherein the one or more passive components include a switch having a matching network.