Liquid crystal display device and method of fabricating the same

Abstract

A liquid crystal display device including a first substrate, a second substrate facing and spaced away from the first substrate, a liquid crystal layer sandwiched between the first and second substrates, a switching device formed on the first substrate, a first electrically insulating film randomly patterned on the first substrate, a second electrically insulating film covering the first electrically insulating film therewith, and having a wavy surface, and a reflection electrode formed on the second electrically insulating film, and electrically connected to an electrode of the switching device, wherein a light passing through the second substrate and the liquid crystal layer is reflected at the reflection electrode, and the second electrically insulating film extends outwardly from the first electrically insulating film by a certain length at an end of a display region in which images are to be displayed, such that a step formed by the first and second electrically insulating films in the vicinity of the end of the display region is smoothed.

1 . A method of fabricating a liquid crystal display device, comprising the steps at least of:
 (a) randomly patterning a first electrically insulating film on a first substrate on which a switching device is fabricated;   (b) covering said first electrically insulating film with a second electrically insulating film; and   (c) forming a reflection electrode on a wavy surface of said first and second electrically insulating films such that said reflection electrode is electrically connected to an electrode of said switching device, said reflection electrode reflecting a light passing through both a second substrate facing and spaced away from said first substrate and a liquid crystal layer sandwiched between said first and second substrates,   said step (b) including:   (b1) forming said second electrically insulating film over said first substrate such that said first electrically insulating film is entirely covered with said second electrically insulating film; and   (b2) partially removing said second electrically insulating film such that said second electrically insulating film extends inwardly from said first electrically insulating film by a certain length at a contact region where said reflection electrode is electrically connected to said electrode of said switching device, thereby a step formed by said first and second electrically insulating films in the vicinity of said contact region is smoothed.   
   
   
       2 . The method as set forth in  claim 1 , wherein said certain length is in the range of about 10 μm to about 12 μm both inclusive. 
   
   
       3 . The method as set forth in  claim 1 , wherein said second electrically insulating film has a thickness in the range of about 0.3 μm to about 1.5 μm both inclusive. 
   
   
       4 . The method as set forth in  claim 1 , wherein said first electrically insulating film has a thickness in the range of about 1 μm to about 3 μm both inclusive. 
   
   
       5 . The method as set forth in  claim 1 , wherein said second electrically insulating film is composed of thermo-flexible organic or inorganic material. 
   
   
       6 . The method as set forth in  claim 1 , wherein said first and second electrically insulating films are composed of different materials from each other. 
   
   
       7 . The method as set forth in  claim 1 , wherein said first and second electrically insulating films are composed of the same material having different viscosities from each other. 
   
   
       8 . The method as set forth in  claim 1 , wherein said first and second electrically insulating films are composed of a combination of organic and inorganic materials. 
   
   
       9 . The method as set forth in  claim 1 , wherein said step (c) includes the steps of:
 (c1) depositing a material of which said reflection electrode is composed, entirely over said second electrically insulating film;   (c2) coating a resist over said material;   (c3) removing said resist in an area in which said material is to be removed; and   (c4) etching said material with said resist being used as a mask.