Architecture for face-to-face bonding between substrate and multiple daughter chips

Abstract

An integrated circuit system includes a first integrated circuit die and a family of second integrated circuit dice. The first integrated circuit die have input/output circuits disposed thereon and further have a first array of face-to-face bonding structures disposed on a first face thereof. Each member of the family of second integrated circuit dice have logical function circuits disposed thereon and further have a second array of face-to-face bonding structures disposed on a first face thereof. The second array of face-to-face bonding structures of each member of the family mates with a different portion of the first array of face-to-face bonding structures.

1 . An integrated circuit system including:
 a first integrated circuit die having input/output circuits disposed thereon and further having a first array of face-to-face bonding structures disposed on a first face thereof;   a family of second integrated circuit dice, each member of the family having logical function circuits disposed thereon and each member of the family further having a second array of face-to-face bonding structures disposed on a first face thereof, the second array of face-to-face bonding structures of each member of the family mates with different portion of the first array of face-to-face bonding structures.