Photoetched Ultrasound Transducer Components

Abstract

A photoetchable glass ceramic is used to form a three dimensional structure for a transducer component. This photostructurable material allows generation of various shapes or structures. For example, a matching layer is formed, in part, using photoetchable glass ceramics with an anechoic-shaped gradient structure. The gradient structures are then filled with materials having desired impedance properties. By allowing generation of desired structures within the matching layer, a desired acoustic impedance property may be provided. As another example, a hollow column is photo etched and used for providing air backing in a backing layer. As yet another example, a transducer layer is formed within a framework of photostructurable material. A plurality of holes with associated shelves is provided for pick-and-place locating of transducer elements within an array. The photostructurable material assists in manufacturing.

1 - 10 . (canceled) 
   
   
       11 . A method for manufacturing an ultrasound transducer, the method comprising:
 microfabricating a component of the ultrasound transducer from a photoetchable glass ceramic; and   stacking the component in a transducer stack.   
   
   
       12 . The method of  claim 11  wherein microfabricating comprises:
 forming an anechoic-shaped gradient structure; and   filling the anechoic-shaped gradient structure;   wherein the component comprises a matching layer.   
   
   
       13 . The method of  claim 11  wherein microfabricating comprises forming a tapered hole, a tapered divot, a tapered groove or combinations thereof in the photoetchable glass ceramic, wherein the component comprises a matching layer. 
   
   
       14 . The method of  claim 11  wherein microfabricating comprises forming a plurality of holes each with a shelf; and further comprising:
 positioning transducer elements within the component, the shelves operable to support the transducer elements;   wherein the component comprises a frame for a transducer layer.   
   
   
       15 . The method of  claim 11  wherein microfabricating comprises forming a hollow column and wherein the component comprises a backing layer for air backed elements. 
   
   
       16 - 20 . (canceled)