Probe card

Abstract

A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced.

1 . A probe card to connect a semiconductor device to test equipment, the probe card comprising:
 a main plate portion having a PCB including an electrical wiring pattern;   a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB;   a plurality of probe needles connected to electrode pads of the semiconductor device; and   a sub-plate portion having an FPCB detachably attached to the main plate portion to connect the PCB and the plurality of probe needles.   
   
   
       2 . The probe card of  claim 1 , further comprising:
 a second connector to connect the PCB to the FPCB;   a main supporter to be connected to or disconnected from a lower surface of the PCB;   a sub-supporter fixed to a lower surface of the main supporter to support the probe needles; and   an epoxy resin formed on a lower surface of the sub-supporter to fix the FPCB and the plurality of probe needles.   
   
   
       3 . The probe card of  claim 2 , wherein the second connector comprises:
 a 2-1 connector fixed on the lower surface of the PCB; and   a 2-2 connector fixed to one end of the FPCB,   wherein the 2-1 connector and the 2-2 connector can be connected when the main supporter is connected to the PCB.   
   
   
       4 . The probe card of  claim 2 , further comprising:
 a capacitor attached to the FPCB to prevent coupling generated between a power line and a ground line.   
   
   
       5 . The probe card of  claim 4 , wherein the capacitor is attached to surface of the FPCB. 
   
   
       6 . The probe card of  claim 4 , wherein the capacitor is embedded using the epoxy resin. 
   
   
       7 . The probe card of  claim 2 , wherein a plurality of main supporters are connected to or disconnected from a single PCB. 
   
   
       8 . The probe card of  claim 2 , wherein:
 the PCB includes a hole having a predetermined size in a center portion thereof; and   the FPCB is connected to the PCB by passing through the hole.   
   
   
       9 . The probe card of  claim 2 , wherein the FPCB and the plurality of probe needles are connected during a soldering process. 
   
   
       10 . The probe card of  claim 2 , wherein the main supporter and the PCB are connected or disconnected using screws. 
   
   
       11 . The probe card of  claim 1 , wherein the FPCB is formed with multiple layers. 
   
   
       12 . The probe card of  claim 1 , wherein the FPCB is a Rigid Flexible (RF) type. 
   
   
       13 . The probe card of  claim 1 , wherein the first connector is a Zero Insertion Force (ZIF) socket. 
   
   
       14 . The probe card of  claim 11 , wherein:
 the plurality of probe needles are arranged in more than two rows; and   the rows may be arranged at a predetermined angle.   
   
   
       15 . The probe card of  claim 14 , wherein each layer of the FPCB contacts a corresponding row of the plurality of probe needles during the soldering process. 
   
   
       16 . A probe card to perform electrical characteristic tests on a semiconductor device, the probe card comprising:
 a main plate portion having a PCB including electrical wiring;   a sub plate portion having an FPCB detachably connectable to the main plate portion; and   a plurality of probe needles connected at one end to the sub-plate portion and having another end at a semiconductor device to perform the electrical characteristic tests.   
   
   
       17 . The probe card of  claim 16 , wherein the main plate portion comprises:
 a first connector fixed on a surface of the PCB to detachably connect the PCB to the FPCB.   
   
   
       18 . The probe card of  claim 17 , wherein the sub plate portion comprises:
 a second connector to detachably connect the first connector of the PCB to the FPCB.   
   
   
       19 . The probe card of  claim 16 , wherein the sub plate portion comprises:
 a first supporter to support the plurality of probe needles and the FCPB and to connect to the PCB.   
   
   
       20 . The probe card of  claim 19 , wherein the supporter comprises at least one hole in which the FCPB can be inserted to reduce a length of the FCPB. 
   
   
       21 . The probe card of  claim 20 , wherein the sub plate portion comprises:
 a second supporter to house a capacitor and to connect to the FPCB and the plurality of probe needles.   
   
   
       22 . The probe card of  claim 21 , further comprising:
 an epoxy resin to mold the capacitor to an inside portion of the second supporter.   
   
   
       23 . The probe card of  claim 16 , wherein:
 the plurality of probe needles are arranged in a plurality of rows; and   the FPCB includes a plurality of layers to correspond to the plurality of rows.   
   
   
       24 . The probe card of  claim 23 , wherein the plurality of rows are arranged at a predetermined angle. 
   
   
       25 . The probe card of  claim 16 , wherein:
 the main plate portion comprises a hole; and   the plurality of probe needles are connected to the PCB through the hole.   
   
   
       26 . The probe card of  claim 16 , wherein:
 the sub plate portion comprises a hole; and   the plurality of probe needles are connected to the PCB through the hole.