Flexible heat cable device

Abstract

A cooling apparatus for cooling an electronic device to be cooled includes a heat collector device which is in thermal contact with the electronic device, a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit, and a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink. The thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means.

1 . A cooling apparatus for cooling an electronic device to be cooled, comprising:
 a) a heat collector device which is adapted to be in thermal contact with the electronic device;   b) a heat sink for absorbing heat which is emitted from the heat collector device and comprising a condenser unit and a thermal interface unit, wherein the condenser unit is cooled down via the thermal interface unit;   c) a heat transfer device made from a flexible material for transferring heat which is emitted from the heat collector device to the heat sink, wherein   d) the thermal interface unit is designed as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means.   
   
   
       2 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the heat transfer device includes an electrical connection unit to simultaneously transfer thermal and electrical energy between the electronic device and the heat sink. 
   
   
       3 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the electronic device forms an integral unit with the heat collector device. 
   
   
       4 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the heat transfer device is made of a thermoplastic polymer. 
   
   
       5 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the heat transfer device is made of at least one of polyethylene, polyethylene-terephthalate and polystyrene. 
   
   
       6 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the heat transfer device includes a metal layer deposited on the outer surface of the heat transfer device. 
   
   
       7 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the heat transfer device is made of super-elastic alloys. 
   
   
       8 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the condenser unit comprises a pump unit for pumping back liquid, which has been collected in a condensate collector. 
   
   
       9 . The cooling apparatus for cooling an electronic device as claimed in  claim 8 , wherein the pump unit of the condenser unit is driven by the flow of cooling water. 
   
   
       10 . The cooling apparatus for cooling an electronic device as claimed in  claim 1 , wherein the heat collector device, the heat sink and the heat transfer device form a thermosyphon device. 
   
   
       11 . A method for cooling an electronic device to be cooled, comprising the following steps:
 a) collecting heat from the electronic device to be cooled by a heat collector device which is in thermal contact with the electronic device to be cooled;   b) transferring heat which is emitted from the heat collector device to a heat sink by means of a heat transfer device made from a flexible material   c) absorbing heat which is emitted from the heat collector device by means of the heat sink comprising a condenser unit and a thermal interface unit, the thermal interface unit being a thermal plug for connecting the condenser unit of the heat sink thermally and removably to an external cooling means; and   
     d) cooling down the condenser unit via the thermal interface unit. 
   
   
       12 . The method for cooling an electronic device to be cooled as claimed in  claim 11 , wherein the heat sink is cooled by a secondary circulation of cooling water. 
   
   
       13 . The method for cooling an electronic device to be cooled as claimed in  claim 11 , wherein the heat transfer device transfers heat from the heat collector device to the heat sink by transporting a liquid coolant from the heat collector device to the heat sink and by returning evaporated coolant from the heat sink to the heat collector device. 
   
   
       14 . The method for cooling an electronic device to be cooled as claimed in  claim 12 , wherein the condenser unit of the heat sink is directly cooled by the circulating cooling water. 
   
   
       15 . A cooling apparatus, comprising:
 a) a heat collector device adapted for a thermal contact;   b) a heat sink for absorbing emitted heat, the heat sink including a condenser unit and a thermal interface unit;   c) a heat transfer device formed of a flexible material for transferring heat from the heat collector device to the heat sink; and   d) an external cooling means, wherein the thermal interface unit is configured as a thermal plug for connecting the condenser unit of the heat sink thermally and removably to the external cooling means.