Modular board device, high frequency module, and method of manufacturing the same

Abstract

The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate ( 11 ) in which conductive pattern or patterns are formed on the principal surface thereof and one element body ( 7 ) or more are mounted, and a second organic substrate ( 12 ) in which a recessed portion ( 22 ) is formed in correspondence with the area where the element body or bodies ( 7 ) are mounted at the connecting surface to the first organic substrate ( 11 ). In the state where the second organic substrate ( 12 ) is connected to the first organic substrate ( 11 ), an element body accommodating portion ( 24 ) which seals the element body or bodies ( 7 ) is constituted by the recessed portion ( 22 ), wherein the element body accommodating portion ( 24 ) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.

1 .- 10 . (canceled) 
     
     
         11 . A method of manufacturing a module board device, including:
 a step of mounting one element body or more onto the principal surface of a first organic substrate in which a conductive pattern or patterns has or have been formed; and   a step of connecting a second organic substrate, in which a recessed portion is formed in correspondence with the area where the element body or bodies is or are mounted at a connecting surface to the first organic substrate in such a manner to seal the element body or bodies into an element body accommodating space portion constituted by the recessed portion so that the element body accommodating space portion is constituted as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained,   a step of forming an insulating resin layer onto the entire surface of at least one second principal surface of the first organic substrate and the second organic substrate of the side opposite to a surface where the first organic substrate and the second organic substrate are connected to each other,   a step of implementing polishing processing to the insulating resin layer to allow the second principal surface to be a planarized (flattened) build-up formation surface, and   a step of forming one build-up wiring layer or more including at least one kind of passive element or more formed by the thin film technology or the thick film technology on the build-up formation surface.   
     
     
         12 . The method of manufacturing module board device as set forth in  claim 11 ,
 wherein the connecting step of the first organic substrate and second organic substrate is performed within inactive gas atmosphere.   
     
     
         13 . The method of manufacturing module board device as set forth in  claim 11 ,
 wherein an air vent hole communicating with the element body accommodating space portion is formed at the first organic substrate or the second organic substrate, and subsequently to the connecting step of the first organic substrate and the second organic substrate, a step of deflating air within the element body accommodating space portion through the air vent hole, a step of filling inactive gas into the element body accommodating portion through the air vent hole, and a step of closing the air vent hole are implemented.   
     
     
         14 . The method of manufacturing module board device as set forth in  claim 11 ,
 wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of sticking adhesive sheet to either one connecting surface of the first organic substrate and the second organic substrate, a step of combining the first organic substrate and the second organic substrate after undergone positioning, and a step of allowing the first organic substrate and the second organic substrate to be in pressure contact with each other.   
     
     
         15 . The method of manufacturing module board device as set forth in  claim 11 ,
 wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of combining the first organic substrate and the second organic substrate after undergone positioning, and a step of applying ultrasonic wave to a connecting surface of the first organic substrate and the second organic substrate to weld it.   
     
     
         16 . The method of manufacturing module board device as set forth in  claim 11 , including:
 a step of forming a shield layer by shield material consisting of silicon oxide, silicon nitride, silicon carbide, boron nitride or Diamond Like Carbon of at least one layer or more which can be formed as film under low temperature condition at an element body mounting area and a recessed portion which constitute at least the element accommodating space portion of the first organic substrate and the second organic substrate,   wherein the element body accommodating space portion is constituted by the shield layer as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained.   
     
     
         17 . The method of manufacturing module board device as set forth in  claim 11 , including
 a step of forming a shield layer consisting of metallic film of at least one layer or more at an element body mounting area and a recessed portion which constitute at least the element accommodating space portion of the first organic substrate and the second organic substrate,   wherein the element accommodating space portion is constituted by the shield layer as a space portion in which electromagnetic wave characteristic is maintained along with moisture resistance characteristic and oxidation resistance characteristic.   
     
     
         18 .- 21 . (canceled) 
     
     
         22 . A method of manufacturing a high frequency module, including;
 a step of manufacturing a base substrate portion via a step of mounting an element body or more on the principal surface of a first organic substrate in which a conductive pattern or patterns is or are formed, a step of connecting a second organic substrate, in which a recessed portion is formed in correspondence with the area where the element body or bodies is or are mounted at a connecting surface to the first organic substrate, to the first organic substrate in such a manner to seal the element body or bodies within the element body accommodating space portion so that the element body accommodating space portion is constituted as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained, a step of forming an insulating resin layer onto the entire surface of at least one second principal surface of the first organic substrate and the second organic substrate of the side opposite to a surface where the first organic substrate and the second organic substrate are connected to each other, and a step of implementing polishing processing to the insulating resin layer to allow the second principal surface to be a planarized (flattened) build-up formation surface; and   a step of forming a high frequency circuit portion via a step of forming one build-up wiring layer or more in which a conductive pattern or patterns is or are formed on a dielectric insulating layer formed at the build-up formation surface of the base substrate portion, and at least one kind of passive element or elements is or are formed by the thin film technology or the thick film technology, the build-up wiring layer being via-connected to the conductive pattern or patterns and/or the element body or bodies of the first organic substrate, and a step of mounting high frequency circuit components (parts) onto the build-up wiring layer of the uppermost layer.   
     
     
         23 . The method of manufacturing high frequency module as set forth in  claim 22 ,
 wherein, at the step of manufacturing the base substrate portion, the connecting step of the first organic substrate and the second organic substrate is performed within inactive gas atmosphere.   
     
     
         24 . The method of manufacturing high frequency module as set forth in  claim 22 ,
 wherein there is used the first organic substrate or the second organic substrate in which an air vent hole communicating with the element body accommodating space portion is formed, and, at the step of manufacturing the base substrate portion, as steps subsequent to the connecting step of the first organic substrate and the second organic substrate, a step of deflating air within the element body accommodating space portion through the air vent hole, a step of filling inactive gas into the element body accommodating space portion through the air vent hole, and a step of closing the air vent hole are implemented to hermetically introduce or fill inactive gas within the element body accommodating space portion.   
     
     
         25 . The method of manufacturing high frequency module as set forth in  claim 22 ,
 wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of sticking adhesive sheet to either one connecting surface of the first organic substrate and the second organic substrate, a step of combining the first organic substrate and the second organic substrate after undergone positioning, and a step of allowing the first organic substrate and the second organic substrate to be in pressure contact with each other.   
     
     
         26 . The method of manufacturing high frequency module as set forth in  claim 22 ,
 wherein the connecting step of the first organic substrate and the second organic substrate consists of a step of combining the first organic substrate and the second organic substrate after positioning, and a step of applying ultrasonic wave to a connecting surface of the first organic substrate and the second organic substrate to weld it.   
     
     
         27 . The method of manufacturing high frequency module as set forth in  claim 22 ,
 wherein the step of forming the build-up wiring layer is adapted so that a first wiring layer is formed via a step of forming photosensitive dielectric layer onto the entire surface of the build-up formation surface of the base substrate portion, a via formation step and a step of forming a conductive pattern or patterns onto the photosensitive dielectric layer, and wiring layers of upper layers are formed in succession via similar steps onto the first wiring layer, and   a step of forming solder resist layer and an electrode formation step are implemented to the wiring layer of the uppermost layer to mount high frequency circuit components (parts).