Substrate treatment method, coating film removing apparatus, and substrate treatment system

Abstract

According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.

1 . A substrate treatment method of performing at least photolithography processing and etching treatment for a substrate in this order a plurality of times, comprising the steps of:
 forming a coating film on a rear surface of the substrate after exposure processing in the photolithography processing is performed; and   removing the coating film between the formation of the coating film and performance of next exposure processing.   
     
     
         2 . The substrate treatment method as set forth in  claim 1 ,
 wherein said step of forming a coating film comprises the steps of:   inverting the substrate to direct the rear surface of the substrate upward; applying a coating solution to the rear surface of the substrate; and curing the coating solution applied on the rear surface of the substrate.   
     
     
         3 . The substrate treatment method as set forth in  claim 1 ,
 wherein said step of removing the coating film comprises the step of supplying a removing solution to the coating film.   
     
     
         4 . The substrate treatment method as set forth in  claim 3 ,
 wherein said step of removing the coating film comprises the step of, before supplying the removing solution to the coating film, inverting the substrate to direct the rear surface of the substrate upward.   
     
     
         5 . The substrate treatment method as set forth in  claim 1 , further comprising the step of:
 immediately before said step of forming a coating film, cleaning the rear surface of the substrate.   
     
     
         6 . The substrate treatment method as set forth in  claim 2 ,
 wherein the coating solution applied on the rear surface of the substrate is cured by being heated.   
     
     
         7 . The substrate treatment method as set forth in  claim 2 ,
 wherein the coating solution applied on the rear surface of the substrate is cured by being irradiated with ultraviolet rays or electron beams.   
     
     
         8 . A coating film removing apparatus for removing a coating film formed on a rear surface of a substrate, comprising:
 a transfer arm transferring the substrate;   a turning mechanism supporting said transfer arm and turning said transfer arm around a horizontal axis;   a raising and lowering mechanism supporting said turning mechanism and raising and lowering said turning mechanism;   a transfer mechanism supporting said raising and lowering mechanism and transferring said raising and lowering mechanism in the horizontal direction;   a substrate holding unit horizontally holding the substrate with the rear surface of the substrate directed upward; and   a removing solution supply nozzle supplying a removing solution for the coating film to the rear surface of the substrate held by said substrate holding unit.   
     
     
         9 . The coating film removing apparatus as set forth in  claim 8 ,
 wherein a rotating mechanism rotating said substrate holding unit around a vertical axis is provided below said substrate holding unit.   
     
     
         10 . The coating film removing apparatus as set forth in  claim 8 ,
 wherein said removing solution supply nozzle is a nozzle having a discharge port in a slit form extending in a direction of a width of the substrate.   
     
     
         11 . A substrate treatment system including a coating film removing apparatus for removing a coating film formed on a rear surface of a substrate and an exposure processing apparatus for performing exposure processing on the substrate,
 said coating film removing apparatus comprising:   a transfer arm transferring the substrate;   a turning mechanism supporting said transfer arm and turning said transfer arm around a horizontal axis;   a raising and lowering mechanism supporting said turning mechanism and raising and lowering said turning mechanism;   a transfer mechanism supporting said raising and lowering mechanism and transferring said raising and lowering mechanism in the horizontal direction;   a substrate holding unit horizontally holding the substrate with the rear surface of the substrate directed upward; and   a removing solution supply nozzle supplying a removing solution for the coating film to the rear surface of the substrate held by said substrate holding unit.   
     
     
         12 . The substrate treatment system as set forth in  claim 11 , further comprising:
 a coating film forming apparatus for forming the coating film on the rear surface of the substrate.