Cu-Ni-Si system copper alloy for electronic materials

Abstract

The present invention provides Corson alloy having remarkably improved properties, in particular, by bringing out the effect of added Cr more efficiently. A copper alloy for electronic materials comprising 2.5-4.5% by mass of Ni; 0.50-1.2% by mass of Si; 0.0030-0.2% by mass of Cr; balance Cu and inevitable impurities, wherein the weight ratio of Ni to Si is in the range of 3 to 7 and the content of carbon is 50 ppm by mass or less is provided.

1 . A copper alloy for electronic materials comprising 2.5-4.5% by mass of Ni; 0.50-1.2% by mass of Si; 0.0030-0.2% by mass of Cr; balance Cu and inevitable impurities, wherein the weight ratio of Ni to Si is in the range of 3 to 7 and the content of carbon is 50 ppm by mass or less. 
     
     
         2 . The copper alloy according to  claim 1 , further comprising one or more element selected from the group consisting of Mg, Mn, Sn and Ag in a total amount of up to 0.5% by mass. 
     
     
         3 . The copper alloy according to  claims 1 , further comprising one or more element selected from the group consisting of Zn, P, As, Sb, Be, B, Ti, Zr, Al, Co and Fe in a total amount of up to 2.0% by mass. 
     
     
         4 . A copper alloy product made of the copper alloy according to any one of  claims 1  to  3 . 
     
     
         5 . An electronic component using the copper alloy according to any one of  claims 1  to  3 .